Search results for: 'packag'

This edition of the Advanced Coating & Surface Technology Opportunity Engine profiles significant nanotechnology advancements for various industrial applications. The featured innovations include Barrier Coating Technology for Paper-based Packaging Solutions, Co-extruded High-barrier Films for Controlled Surface Performance, Multilayer Cast Extrusi...

This issue of High-Tech Materials Technology Opportunity Engine (TOE) profiles significant advancements in high-tech materials for various enhanced industrial applications. The featured innovations include Lightweight Thermoplastic Composites for Multi-Industrial Usage, Biodegradable Packaging Alternative to Conventional Plastic Bottles, Carbon Fib...

29 Jan 2021  |  Global  |  Market Research

Packaging and ICT Industry Convergence Propels Advancement of the Global Smart Label Materials Market

Increasing Requirements for Digital Tracing and Tracking in the Retail, Healthcare, and Food & Beverage Value Chains Fuel Growth Strategies

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Frost & Sullivans study of the global smart label materials market analyzes the growth drivers, challenges, and trends that affect participants in this space. The study period is 2017 to 2027 using a base year of 2020 and a forecast period of 2021 to 2027. The global market is segmented into the following regions: Americas, Europe, Middle East, Afr...

This edition of the Advanced Coating & Surface Technology Opportunity Engine profiles significant advances in advanced coatings and surface treatments for various industrial applications. The featured innovations include Automated High-speed Coating and UV-cure Solutions, Water-based Functional Aluminum Coating for Battery Components, Self-cleaning...

The Microelectronics Technology Opportunity Engine focusses on capturing innovations related to Memristors, Open-Source Processors, Chip Integrated Capacitor, 3D Packaging, Neuromorphic Chip, Hybrid Transistor, Quantum Processor, Cryogenic Memory, Photonic Chip, Ion Based Quantum Chip.The Microelectronics Technology Opportunity Engine captures glob...

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...

There is lot of buzz around phygital (physical plus digital) and Internet of Things (IoT) connected ecosystem. With the evolution of new-age technology, which is built on the foundation of connectivity, efficiency, and increased automation. The retail and packaging industry is gradually moving toward the phygital world. Phygital combines the strate...

This study assesses the global tape market's current status and future prospects and quantifies the adhesives used in tapes. It takes into account volume shipment and the revenue generated from the adhesives used in tapes from 2020 to 2030. The study examines different chemistries, including acrylic, rubber, silicones, epoxy, and PU, as well as adh...

26 May 2021  |  Global  |  Market Research

Global Industrial Adhesives and Sealants Growth Opportunities

Technology Strategies Focus on Sustainable Products, Flexible Packaging, and High-end Electronics Applications

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This study presents an assessment of the current status and prospects of the global market for industrial adhesives and sealants. It considers the market’s volume shipment and revenue from 2017 to 2027. The research identifies growth opportunities and challenges pertaining to the consumption of adhesives and sealants by end-use industries, namely p...