1.1 Research Scope

1.2 Research Methodology

1.2 Research Methodology (continued)

1.3 High Speed Data Transmission and Manufacturing Innovations are Key to Developments in PICs

1.4 Telecom and Datacentres are Major Beneficiaries of PICs

2.1 Technological Significance of Photonic Integrated Circuits

2.2 Segmentation of PICs

2.3 Demand for High Speed Data Transmission and Advancements in Datacentres Enable Growth of PICs

2.4 Advancements in PIC Manufacturing and Energy Savings Propel the Development of PICs

2.5 Challenges Hindering the Adoption of PICs

3.1 Concept of Optical Waveguides

3.2 Materials Used in Development of PICs

3.3 Fabrication and Photonic Integration of PICs

3.4 Devices Incorporating PICs

3.5 Supply Chain Model for PICs

4.1 Patent Trend Analysis

4.2 Inference from Patent Analysis: Key Focus Areas

4.3 Key Patent Holders Driving Innovation

4.4 Funding Scenarios in PICs

4.5 Telecom, Healthcare, and Datacenters are High Impact Sectors

4.6 Implementation of PICs in the Electronics Industry

5.1 Optical Communication based on Sound Waves

5.2 Quantum Dot Lasers for Photonic Integrated Circuits (PICs)

5.3 Silicon- based PICs Fabrication Technology

5.4 Optical Phased Arrays Developed using Silicon Nitride

5.5 Optical Transceivers for High-speed Data Movement

5.6 Quantum Photonic Circuits

5.7 Optical Communication Using Optical Comb Source System

5.8 Optical Interconnects Developed using Glass-based 3D PIC Platform

6.1 The Road Ahead – 2022 Forecast

6.2 From the Analyst’s Desk: What is the Nature of Competition and Global Adoption Scenario for PICs?

6.3 From the Analyst’s Desk: What are the Key Attractive Applications and Future Opportunities for PICs?

7.1 Key Contacts

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