Emerging Trends in Semiconductor Testing and Semiconductor ATE (Technical Insights)
14-Jun-2006
Technology Research
D655-01-00-00-00
ES00526-GL-TR_15854
$4,950.00
Special Price $3,712.50 save 25 %
Scope and Research Methodology
- Scope
- Research Methodology
Introduction and Key Findings
- Introduction
- Key Findings
Role of Testing in IC Chip Production Flow
Market and Technology Trends
- Typical Production Flow
- Engineering and Manufacturing Testing
ATE and DFT Technologies
Testing Diagnostic Tools and Software
Noteworthy Future Technologies
- 6.5 Gbps Open Architecture ATE Solution
- ATE Industry's First Universal Slot Open Architecture Solution
- ATE with Advanced IC Reliability Testing Features
- Fully Automated On-Wafer RF Testing
- New ATE Solution with 12.8 Gbps Bit Rate
- Calibration using Robotic Control
- X-Compact:A Compaction Technique for Increasing Semiconductor Chip Testing Requirements
- X-PAND: An Efficient Test Stimulus Compression Technique
- DFT Analyzer Validates DFT Features before Prototyping
- DFT Technology That Cuts ATE Overheads
- Fully Integrated Embedded Test and Diagnostic Solution for 90 nm and Beyond
- Next Generation 1-Pass Test Synthesis
Adoption Factors
Forecasts
Key Contacts
Selected Patents and Glossary
Excellence in Technology Award
Technology Innovation Award
Product Innovation Award
Semiconductor End-Product Market Statistics
Semiconductor Industry Statistics
Speak directly with our analytics experts for tailored recommendations.
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| Deliverable Type | Technology Research |
|---|---|
| No Index | No |
| Podcast | No |
| Industries | Electronics and Sensors |
| WIP Number | D655-01-00-00-00 |
| Is Prebook | No |