Future Opportunites for 3D Integrated Circuits

Future Opportunites for 3D Integrated Circuits

3D Stacked Memory and 3D MEMS Driving Opportunities in Consumer Electronics and Communication Markets

RELEASE DATE
27-Dec-2016
REGION
Global
Research Code: D77D-01-00-00-00
SKU: ES00915-GL-TR_19238

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Description

3D Integrated Circuit technology enables the development of high performing microchips with small form factor and low-power consumption capability. With the growing demand for miniaturization in industries like consumer electronics and information and communication technology, 3D ICs are actively being considered as the ideal solution. The key requirements of modern day electronic devices are enhanced storage capability, low power requirements, efficient thermal management components, high-speed data transmission, high-speed data processing, high brightness lighting, connected and smart devices. These requirements from the consumer end of the supply chain are the key driving forces behind growth in 3D IC technology and its inherent market.
A notable feature of the 3D IC market ecosystem is that the vendor side of the supply chain is highly fragmented. This is mainly because of the numerous options available for 3D Integration. Also, the business models adopted by 3D IC fabrication companies are constantly evolving. The core technology is constantly being updated to the next-generation technology, foundries transitioning to end-to-end product developers, fabless designers venturing into software-based 3D designing and so on.
This technology and innovation report highlights through silicon vias (TSV) as the key technology in 3D IC technology. The report discusses the market and technological drivers and restraints for the 3D IC market and identifies the various technologies enabling 3D integration. TSV interconnect technology is analyzed exhaustively by evaluating key participants and their strategies in the TSV-enabled 3D integration sector. An Integrated Technology Roadmap (ITR) is developed by tracking the developments in the 3D integration technology. The ITR outlines the various industries that has been and is expected to witness moderate to high impact of these innovative products presently and in the in future. The growth opportunities for 3D IC are exhaustively analyzed through the ITR lens.

Table of Contents

1.1 Research Scope

1.2 Research Methodology

1.3 Research Methodology Explained

1.4 3D Integration Technology Categorization

1.5 Key Findings – Significance, R&D Focus Areas, and Applications

1.6 Key Findings – Global Challenges and Scenario, Industry Initiatives

2.1 Three-dimensional Integrated Circuits – An Introduction

2.2 High Bargaining Power of Suppliers and Threat of New Entrants Impacting Attractiveness of 3D IC Industry

2.3 Continuing Demand for Smartphones and Expected Increase in Cost Currently Driving Opportunities in 3D ICs

2.4 Key Drivers Explained

2.5 High Cost and Technological and Process Challenges Currently Limiting Opportunities for 3D ICs

2.6 Key Market Restraints Explained

2.7 Technological Drivers and Challenges

2.8 Technological Drivers

2.9 Technological Challenges

3.1 3D IC Packaging Techniques Enable Vertical Integration

3.2 3D Monolithic Integration

3.3 3D Integration – Die Singulation

3.4 3D Integration – Stacking Orientation

3.5 3D Integration – Bonding Technique

3.6 3D Integration – Through Silicon Vias

3.7 3D Integration – Wafer Type

4.1 APAC and NA Actively Focusing on R&D in 3D Integration Technology

4.2 Research on Through Silicon Via is Actively Pursued Across the Globe

4.3 Pursuit of Technological and Market Leadership Outlines Funding Trends

5.1 Introduction to TSV Technology

5.2 3D IC Enabled with TSV is the Next Frontier in 3D Integration Technology

5.3 Interconnect Drilling, Wafer Thinning and Stacking form Core TSV Interconnect Process Technology

5.4 Key Innovation Profile – Allvia Inc.

5.5 Key Innovation Profile – Amkor Technologies

5.6 Key Innovation Profile – Novati Technologies

5.7 Key Innovation Profile – Aveni

5.8 Key Innovation Profile – STATS ChipPAC

5.9 Key Players in 3D IC Industry

6.1 Memory, Microelectromechanical Systems, and Image Sensors are Key Products Enabled with 3D IC

6.2 Consumer Electronics, ICT, and Aerospace are Major Application Areas of 3D IC

6.3 Product – Application Impact Matrix

6.4 Impact of Products on Application Areas Explained

7.1 Integrated Technology Roadmap

7.2 Integrated Technology Roadmap Explained – 3D Integration Enabled Products Driving Futuristic Innovations in Major industries

7.3 Growth Opportunities

7.4 Key Questions for Strategic Planning

8.1 Key Patents

8.1 Key Patents (continued)

9.1 Industry Contacts

Legal Disclaimer

10.1 The Frost & Sullivan Story

10.2 Value Proposition: Future of Your Company & Career

10.3 Global Perspective

10.4 Industry Convergence

10.5 360º Research Perspective

10.6 Implementation Excellence

10.7 Our Blue Ocean Strategy

Related Research
3D Integrated Circuit technology enables the development of high performing microchips with small form factor and low-power consumption capability. With the growing demand for miniaturization in industries like consumer electronics and information and communication technology, 3D ICs are actively being considered as the ideal solution. The key requirements of modern day electronic devices are enhanced storage capability, low power requirements, efficient thermal management components, high-speed data transmission, high-speed data processing, high brightness lighting, connected and smart devices. These requirements from the consumer end of the supply chain are the key driving forces behind growth in 3D IC technology and its inherent market. A notable feature of the 3D IC market ecosystem is that the vendor side of the supply chain is highly fragmented. This is mainly because of the numerous options available for 3D Integration. Also, the business models adopted by 3D IC fabrication companies are constantly evolving. The core technology is constantly being updated to the next-generation technology, foundries transitioning to end-to-end product developers, fabless designers venturing into software-based 3D designing and so on. This technology and innovation report highlights through silicon vias (TSV) as the key technology in 3D IC technology. The report discusses the market and technological drivers and restraints for the 3D IC market and identifies the various technologies enabling 3D integration. TSV interconnect technology is analyzed exhaustively by evaluating key participants and their strategies in the TSV-enabled 3D integration sector. An Integrated Technology Roadmap (ITR) is developed by tracking the developments in the 3D integration technology. The ITR outlines the various industries that has been and is expected to witness moderate to high impact of these innovative products presently and in the in future. The growth opportunities for 3D IC are exhaustive
More Information
No Index No
Podcast No
Author Brinda Manivannan
Industries Electronics and Sensors
WIP Number D77D-01-00-00-00
Keyword 1 3D IC technology
Keyword 2 3D IC Packaging
Keyword 3 3D Integrated Circuit technology
Is Prebook No