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Growth Opportunities in Edge AI Sensors, Displacement Sensors, Hall Effect Sensors, Pressure Sensors, Force Sensors, TENG Sensors and Terahertz Sensors. Updated Research Available
Sensor Technology Opportunity Engine
18-Jul-2025
Global
Technology Research
D727-00-E8-00-00
TM_2025_33667
The Sensor Technology Opportunity Engine provides profiles of innovations related to Multi-Scenario Edge AI Sensing System, 3-gain Design Based InGaAs Sensor, Non-Contact Displacement Sensor Solutions for Industry 4.0 Applications Non-Contact Hall Effect Precision for Harsh Environments, Stacked SPAD Depth Sensor for Automotive dToF LiDAR and Smart 9-Axis Absolute Orientation Sensor for Motion Tracking.
Sensor Technology Opportunity Engine (TOE) captures global sensor-related innovations and developments on a monthly basis. Innovations are directed toward developing smart and intelligent sensors with functionalities beyond sensing. Research focus areas include low power sensors (energy harvesting), industrial automation sensors (M2M, vision sensor), ubiquitous sensor (WSN, sensor fusion), smart sensors (wearables, quantified self), high sensitivity and smaller size (MEMS, nanosensors), and improved security (CBRNE, terahertz). The need for low power, smaller, lighter sensors with enhanced performance attributes and minimal false alarms is driving innovations in the sensors space.
The Sensors and Instrumentation cluster covers innovations pertaining to technologies such as wireless sensors and networks, energy harvesting, haptics and touch, MEMS and nanosensors, Terahertz, ubiquitous/smart sensors, CBRNE, quantified-self, sensor fusion, M2M communications, and drones.
Keywords: Edge AI, LiDAR, Depth sensing, Pressure sensing
Himax Technologies, Taiwan
New Imaging Technologies, France
Bosch, Germany
Canon, Japan
NewTek Sensor Solutions, US
Sony Semiconductor Solutions SSS Group, Japan
Renesas Electronics Corporation, Japan
Infineon Technologies, Germany
Sensata Technologies, United States
STMicroelectronics, Switzerland
TeraSense, United States
Bosch Sensortec, Germany
SICK AG, Germany
Tekscan, United States
Polus Tech, Switzerland
TDK Corporation, Japan
Indian Institute of Science IISc, India
Flintec, Sweden
Pressure Profile Systems, United States
Sungkyunkwan University SKKU, South Korea
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