Search results for: 'package-on-package'

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

28 Jun 2019  |  Global  |  Market Research

Impact of Future Technologies on the Global Defense Market, 2019–2029

A Number of Intertwined Technological Areas are Advancing in Synergy, Creating a Level of Mutual Dependency that will Transform the Future Battlespace

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This is an age of rapid technological change, with new lines of thought driving novel innovations and business models. As a result, limitations are beginning to emerge in the technological capabilities of the current military to counter new threats. The emergence of new technologies has exposed military forces to new vulnerabilities, which requires...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...

22 Dec 2020  |  Global  |  Market Research

New Sensor Technologies Driving the Global EO/IR Market, 2020

Future Growth Potential Enhanced by Growth Opportunities in Vehicular Sensor Suites and Handheld Surveillance Systems

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Key Issues Addressed

Ministries of defense are procuring a range of new equipment to ensure that soldiers are more lethal and less vulnerable on the modern battlefield. There is an increased demand for weapon sights and night-vision goggles as part of soldier modernization programs. Newer companion technologies, such as unmanned ground vehicles, are being combined wit...

This Frost Radar evaluates companies that develop and provide unmanned ground solutions for the commercial last-mile delivery market. An unmanned ground vehicle (UGV) is a small or medium-sized system designed to operate under remote control and may be capable of operating semi or fully autonomously. UGVs are gaining relevance in the logistics and...

This study covers 14 key countries that are looking to invest in airborne Electronic Warfare (EW) capabilities due to rising threat perceptions. Revenue is forecasted for some countries with established or published EW programs while qualitative assessment has been done for others. Key platform procurement and upgrade programs are covered, focusing...

19 Nov 2021  |  Global  |  Market Research

Military Cyber CONOPS Growth Opportunities

New Product Development Based on Big Data and Artificial Intelligence is Driving the Shift in CONOPS

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Key Issues Addressed

Digitization is transforming every aspect of the defense industry, from back-end office operations to the training of military personnel. Cyberwarfare has become common, and cyberspace has turned into a battlefield for major geopolitical and social issues, with different nations using it to gather intelligence or engage in shadow diplomacy. Cybe...