Search results for: '(material characterization)'

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

This study characterizes the worldwide market for Traditional Sonet/SDH optical networking systems. This equipment class includes the vast majority of the Sonet and SDH gear installed throughout the 1990s. It includes multiplex terminals and add drop multiplexers (ADM) for core long haul transport and metro/regional transport and access.

The collaboration and communication device landscape is undergoing a structural shift, characterized by steady realignment driven by hybrid work standardization, AI maturity, regulatory pressure, and constrained IT investment cycles.Across global markets, enterprises are recalibrating to a stable hybrid work baseline, while demand for higher-qualit...

This study examines the dynamic shift in the global manufacturing industry towards digitalization. Visible particularly in sectors such as automotive, aerospace, and electronics, the shift is characterized by the increasing adoption of automation, artificial intelligence (AI), the Internet of Things (IoT), and other such technologies. Supply chain ...

The collaboration and communication device landscape is undergoing a structural shift, characterized by steady realignment as AI and hybrid work reshape the workplace. Across global markets, enterprises are recalibrating to a adjust to the hybrid work baseline, while the demand for higher-quality, more intelligent endpoints continues to rise. Custo...

The Asia-Pacific (APAC) B2B digital payments market is experiencing rapid transformation, driven by surging digital adoption, advancements such as API standardization (e.g., ISO 20022 and Open API frameworks), and regulatory harmonization for payment interoperability (e.g., ASEAN payment connectivity and India’s Unified Payments Interface [UPI]). K...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...

Huddle room collaboration is a hot topic these days. The hype surrounding this trend has produced many misconceptions, making it difficult to grasp what huddle room collaboration entails. As organizations design smarter meeting spaces to foster collaboration, it’s time to take a closer look at huddle rooms and the growth opportunities in this marke...

This study discusses the U.S. market for enterprise telephony equipment services including private branch exchange system (PBX), key telephony system (KTS), Internet protocol private branch exchange system (IP PBX) and terminal (analog, digital and IP phones) installation, professionals services, contractual maintenance, time and material (T&M) cha...