Search results for: 'system on models soc'

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Memory, Processors, Chip Manufacturing, and Compound Semiconductors among many others.The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electro...

17 Jul 2015  |  Global  |  Market Research

Analysis of the LED Lighting Market in the Global Automotive Industry

Trends and Opportunities Poised to Shape the Future

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Globally, LEDs are gaining traction because of improved cost, design, and performance. The LED lighting market in the automotive industry is growing as LEDs are starting to be utilized in mass market vehicles and lighting suppliers look to provide innovative LED solutions to be used in advanced lighting technologies like adaptive lighting systems a...

Wireless communication systems rely on semiconductor components, such as PAs, LNAs, and transceivers (together known as RF FEMs), to process signals to and from the radio unit (RU), baseband unit (BBU), and the network core to ensure customers receive the radio signals that carry the data and services. The communication system relies on other se...

The Microelectronics Technology Opportunity Engine provides profiles of innovations related to high-performance FPGA-based system-on-module (SoM), mobile processors for consumers, MPS-based SiC diodes for industrial applications, FPGA for Edge applications, and enhanced AI processors for IoT applications.The Microelectronics Technology Opportunity ...

The Big 4 sensors—pressure, flow, temperature and level—measure parameters that are most critical to both process and discrete field monitoring applications. This research service analyzes the global market for flow, level, pressure, and temperature sensors and transmitters and offers a quantitative model with revenues and forecasts for the flow, l...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics. Some of the innovations profiled include Chips on Panel on Substrate Advanced Chip Packaging for Next-Gen AI Systems, Room-Temperature Printable Ink for Adaptive Electronics, GaN for Ultra-Fast 6G...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to SRAM, Multi-chip Architecture, LoRa and AI Accelerators. Some of the innovations profiled include 2nm Custom SRAM for AI & Cloud Infrastructure Applications, Modular Quantum System with Reduced Gate Error and Multi-Chip Architecture, Microcontroller Series with High...

Industry 4.0 is enabling smart factories by configuring cyber-physical (Internet-connected) systems coupled with artificial intelligence (AI) to leverage the Industrial Internet of Things (IIoT) for seamless machine-to-machine communication, data transfer, and advanced automation of processes throughout the manufacturing value chain. The opportunit...

LiDAR is an optical remote sensing and imaging technology that utilizes non-visible light to map the ground surface and objects present on the surface of the Earth. It simultaneously captures millions of measurements of depth information in all directions and then creates high-resolution maps. The need for adapting LiDAR technologies in consumer...