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Growth Opportunities in Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics Updated Research Available
Microelectronics Technology Opportunity Engine
18-Jul-2025
Global
Technology Research
D777-00-F4-00-00
AE_2025_33664
The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics. Some of the innovations profiled include Chips on Panel on Substrate Advanced Chip Packaging for Next-Gen AI Systems, Room-Temperature Printable Ink for Adaptive Electronics, GaN for Ultra-Fast 6G Networks, 3D Antenna-in-Package (AiP) and Next-gen Quantum Built On Photonics among others.
The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).
Keywords: Advanced packaging, chip packaging, Edge AI, AI accelerator, photonics, 6G, GaN, adaptive electronics, printable ink, graphene, memory, quantum
Compact Edge AI system-on-module with Integrated High-Performance Accelerator --Virtium Embedded Artists, Sweden
Room-Temperature Printable Ink for Adaptive Electronics --Korea Advanced Institute of Science & Technology KAIST, South Korea
GaN Semiconductor Technology Paving the Way for Ultra-Fast 6G Networks -University of Bristol, United Kingdom
Adaptive Write Technology Based Memory For High-Speed Compute --Micron Technology, United States
Isolated Gate Driver IC For Enhanced High Frequency Operations --Rohm Semiconductor, Japan
Microcontroller With AI Acceleration For Improved AI Efficiency --Renesas Electronics, Japan
3D Antenna-in-Package AiP For Enhanced Satellite Communication -Circuits Integrated Hellas, Greece
Compact Phased Array Transceiver For Enhanced 6G Applications -Institute of Science Tokyo, Japan
Advanced Amplifier For Energy Efficient Quantum Computing -Chalmers University of Technology, Sweden
Graphene-Ferroelectric Devices enabling The Future Of Memory -Paragraf, United Kingdom
Redefining Semiconductor Packaging With Glass Substrates -Absolics Inc., United States
Advancing Photonic Quantum Computing -PsiQuantum, California, USA
Next-gen Quantum Built On Photonics -Xanadu, Canada
Enabling High-speed Quantum Computing Via TFLN Photonics -Quantum Computing Inc., United States
Scalable Photonic Platform Enabling 1.6 Terabit Connectivity -Coherent Corp., United States
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