Toggle Nav
My Cart
Search
Menu
Account
Settings
Aerospace, Defence and Security Growth Opportunities in Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics Updated Research Available

Microelectronics Technology Opportunity Engine

SECTOR
Security

RELEASE DATE
18-Jul-2025
REGION
Global
DELIVERABLE TYPE
Technology Research

RESEARCH CODE
D777-00-F4-00-00
SKU
AE_2025_33664
Yes
SHARE

Growth Opportunities in Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics
Published on: 18-Jul-2025 | SKU: AE_2025_33664

Need more details?

$950.00

$855.00 save 10 %

Link1
Request Sample
Add to Compare
Need more details?
Description

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics. Some of the innovations profiled include Chips on Panel on Substrate Advanced Chip Packaging for Next-Gen AI Systems, Room-Temperature Printable Ink for Adaptive Electronics, GaN for Ultra-Fast 6G Networks, 3D Antenna-in-Package (AiP) and Next-gen Quantum Built On Photonics among others.

The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Keywords: Advanced packaging, chip packaging, Edge AI, AI accelerator, photonics, 6G, GaN, adaptive electronics, printable ink, graphene, memory, quantum

Table of Contents

Compact Edge AI system-on-module with Integrated High-Performance Accelerator --Virtium Embedded Artists, Sweden

Room-Temperature Printable Ink for Adaptive Electronics --Korea Advanced Institute of Science & Technology KAIST, South Korea

GaN Semiconductor Technology Paving the Way for Ultra-Fast 6G Networks -University of Bristol, United Kingdom

Adaptive Write Technology Based Memory For High-Speed Compute --Micron Technology, United States

Isolated Gate Driver IC For Enhanced High Frequency Operations --Rohm Semiconductor, Japan

Microcontroller With AI Acceleration For Improved AI Efficiency --Renesas Electronics, Japan

3D Antenna-in-Package AiP For Enhanced Satellite Communication -Circuits Integrated Hellas, Greece

Compact Phased Array Transceiver For Enhanced 6G Applications -Institute of Science Tokyo, Japan

Advanced Amplifier For Energy Efficient Quantum Computing -Chalmers University of Technology, Sweden

Graphene-Ferroelectric Devices enabling The Future Of Memory -Paragraf, United Kingdom

Redefining Semiconductor Packaging With Glass Substrates -Absolics Inc., United States

Advancing Photonic Quantum Computing -PsiQuantum, California, USA

Next-gen Quantum Built On Photonics -Xanadu, Canada

Enabling High-speed Quantum Computing Via TFLN Photonics -Quantum Computing Inc., United States

Scalable Photonic Platform Enabling 1.6 Terabit Connectivity -Coherent Corp., United States

Request Sample

Have questions about this research or need deeper insights?
Speak directly with our analytics experts for tailored recommendations.

Recent related Security research

15 Sep 2026   |   Global   |   Market Research

Total Cloud Security Market, Global, 2025–2031

Although the cloud security market remains driven by CNAPP, the definition of cloud security is expanding into a broader and more integrated platform. CNAPP remains the foundation of enterprise cloud security, with core capabilities such as posture management, workload protection, identity security ...

11 Sep 2026   |   Global   |   Technology Research

Growth Opportunities in 3D Memory Architecture, SoCs, and Chiplets

The Microelectronics Technology Opportunity Engine covers innovations pertaining to 3D Memory Architecture, SoCs, and Chiplets.The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electroni...

09 Sep 2026   |   Global   |   Technology Research

Unified Cloud Control: The Emergence of Intelligent Multi-Cloud Management Platforms, 2026-2030

This report emerges as the evolution of an integrated cloud manipulation management system as complementary technology for employer cloud manipulation management systems to enable businesses to manage increasingly distributed workloads in public, private, hybrid, edge, and sovereign clouds in one ma...

19 Aug 2026   |   Global   |   Frost Radar

Frost Radar™: Cloud Workload Protection Platforms, 2026

Organizations worldwide continue to accelerate cloud, cloud-native, and AI adoption. Multicloud and hybrid cloud strategies are now standard for large enterprises, while containers, Kubernetes clusters, serverless functions, cloud virtual machines, APIs, and AI workloads are becoming the execution l...

13 Aug 2026   |   Global   |   Market Research

Customer Transformation Journeys - Modern Security Information and Event Management (SIEM): NSFOCUS

This report examines how NSFOCUS Intelligent Security Operations Platform (ISOP) helps organizations modernize security operations amid rising cyber threats, expanding alert volumes, and persistent cybersecurity talent shortages. Based on Frost & Sullivan’s independent analysis and customer intervie...

 

Purchase includes:
  • Report download
  • Growth Dialog™ with our experts
Related Research
  1. Growth Opportunities in AI Processors, Silicon Photonics, SoCs and Chiplets
    Release Date: 07-Aug-26
  2. Growth Opportunities in Sub-1 Nm Chip technology, MMIC, SOC, Photonic Chiplet, GaN and Power Electronics
    Release Date: 10-Jul-26
  3. Growth Opportunities in Microcontrollers, Low Power MCU’s, GaN and AI Interconnects
    Release Date: 10-Apr-26
  4. Growth Opportunities in Processors, Packaging, Transceivers, Wireless Connectivity and Thermal Management
    Release Date: 09-Jan-26
  5. Growth Opportunities in GAA Transistors, AI Chips, 3D IC, CubeSat, GaN-on-Si, and Advanced Processors
    Release Date: 13-Mar-26

Growth Dialog™

A tailored session with you where we identify the:
  • Strategic Imperatives
  • Growth Opportunities
  • Best Practices
  • Companies to Action

Impacting your company's future growth potential.

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics. Some of the innovations profiled include Chips on Panel on Substrate Advanced Chip Packaging for Next-Gen AI Systems, Room-Temperature Printable Ink for Adaptive Electronics, GaN for Ultra-Fast 6G Networks, 3D Antenna-in-Package (AiP) and Next-gen Quantum Built On Photonics among others.

The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Keywords: Advanced packaging, chip packaging, Edge AI, AI accelerator, photonics, 6G, GaN, adaptive electronics, printable ink, graphene, memory, quantum
More Information
Deliverable Type Technology Research
Industries Aerospace, Defence and Security
No Index No
Is Prebook No
Keyword 1 advanced chip packaging market
Keyword 2 edge AI accelerators market
Keyword 3 GaN technology market
Podcast No
Predecessor D777-00-F3-00-00
WIP Number D777-00-F4-00-00

Growth Opportunities in Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics

$950.00

Special Price $855.00 save 10 %

In stock
SKU
AE_2025_33664