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Aerospace, Defence and Security Growth Opportunities in Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics Updated Research Available

Microelectronics Technology Opportunity Engine

SECTOR
Security

RELEASE DATE
18-Jul-2025
REGION
Global
DELIVERABLE TYPE
Technology Research

RESEARCH CODE
D777-00-F4-00-00
SKU
AE_2025_33664
Yes
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Growth Opportunities in Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics
Published on: 18-Jul-2025 | SKU: AE_2025_33664

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Description

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics. Some of the innovations profiled include Chips on Panel on Substrate Advanced Chip Packaging for Next-Gen AI Systems, Room-Temperature Printable Ink for Adaptive Electronics, GaN for Ultra-Fast 6G Networks, 3D Antenna-in-Package (AiP) and Next-gen Quantum Built On Photonics among others.

The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Keywords: Advanced packaging, chip packaging, Edge AI, AI accelerator, photonics, 6G, GaN, adaptive electronics, printable ink, graphene, memory, quantum

Table of Contents

Compact Edge AI system-on-module with Integrated High-Performance Accelerator --Virtium Embedded Artists, Sweden

Room-Temperature Printable Ink for Adaptive Electronics --Korea Advanced Institute of Science & Technology KAIST, South Korea

GaN Semiconductor Technology Paving the Way for Ultra-Fast 6G Networks -University of Bristol, United Kingdom

Adaptive Write Technology Based Memory For High-Speed Compute --Micron Technology, United States

Isolated Gate Driver IC For Enhanced High Frequency Operations --Rohm Semiconductor, Japan

Microcontroller With AI Acceleration For Improved AI Efficiency --Renesas Electronics, Japan

3D Antenna-in-Package AiP For Enhanced Satellite Communication -Circuits Integrated Hellas, Greece

Compact Phased Array Transceiver For Enhanced 6G Applications -Institute of Science Tokyo, Japan

Advanced Amplifier For Energy Efficient Quantum Computing -Chalmers University of Technology, Sweden

Graphene-Ferroelectric Devices enabling The Future Of Memory -Paragraf, United Kingdom

Redefining Semiconductor Packaging With Glass Substrates -Absolics Inc., United States

Advancing Photonic Quantum Computing -PsiQuantum, California, USA

Next-gen Quantum Built On Photonics -Xanadu, Canada

Enabling High-speed Quantum Computing Via TFLN Photonics -Quantum Computing Inc., United States

Scalable Photonic Platform Enabling 1.6 Terabit Connectivity -Coherent Corp., United States

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The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics. Some of the innovations profiled include Chips on Panel on Substrate Advanced Chip Packaging for Next-Gen AI Systems, Room-Temperature Printable Ink for Adaptive Electronics, GaN for Ultra-Fast 6G Networks, 3D Antenna-in-Package (AiP) and Next-gen Quantum Built On Photonics among others.

The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Keywords: Advanced packaging, chip packaging, Edge AI, AI accelerator, photonics, 6G, GaN, adaptive electronics, printable ink, graphene, memory, quantum
More Information
Deliverable Type Technology Research
Industries Aerospace, Defence and Security
No Index No
Is Prebook No
Keyword 1 advanced chip packaging market
Keyword 2 edge AI accelerators market
Keyword 3 GaN technology market
Podcast No
Predecessor D777-00-F3-00-00
WIP Number D777-00-F4-00-00

Growth Opportunities in Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics

$950.00

Special Price $855.00 save 10 %

In stock
SKU
AE_2025_33664