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23 Dec 2022  |  Global  |  Technology Research
Sensor Technologies Impacting the Physical and Digital Security Market
LiDAR and ICT Technologies Drive Security Market Growth
Physical security information management provides a comprehensive approach to thwarting attacks through the integration, correlation, visualization, workflow, and analysis of data obtained from events. All physical security systems, including intrusion detection, access control, video surveillance, and building management systems, are connected via...
$4,950.00 -
27 Dec 2016  |  Global  |  Technology Research
Future Opportunites for 3D Integrated Circuits
3D Stacked Memory and 3D MEMS Driving Opportunities in Consumer Electronics and Communication Markets
3D Integrated Circuit technology enables the development of high performing microchips with small form factor and low-power consumption capability. With the growing demand for miniaturization in industries like consumer electronics and information and communication technology, 3D ICs are actively being considered as the ideal solution. The key requ...
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13 Feb 2026  |  Global  |  Technology Research
Growth Opportunities in Chiplet Architecture, AI Computation, SoC, and Flexible ICs
Microelectronics Technology Opportunity Engine
The Microelectronics Technology Opportunity Engine covers innovations pertaining to Chiplet Architecture, AI Computation, SoC, and Flexible ICs.The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power and co...
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12 Dec 2008  |  Global  |  Market Research
World Display Driver ICs Market
This research service discusses the world market for display driver ICs. The research covers an analysis for LED driver ICs, LCD driver ICs and OLED driver ICs. The research service forecasts both the total revenues and units shipment and the market is analyzed based on key end-applications or product types.
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08 Mar 2004  |    |  Market Research
World Power Management ICs Markets
The world power management ICs is segmented into four segments comprising of the switching converters (AC-DC & DC-DC) ICs, voltage regualtors and references, integrated ASSP power management ICs and motor control ICs. Each segment discusses current issues facing the market, revenue forecasts, market, technology and pricing trends and competitive an...
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30 Sep 2006  |    |  Market Research
Strategic Analysis of the World Power Management ICs Markets
This study focuses on the world power management ICs market. The power management ICs have been classified into 6 segments and three segments have been further classified into sub segments. This study gives an indepth analysis of the challenges, market drivers, restraints and technological trends at segment level. Market forecast has been done with...
$4,950.00 -
This study focuses on the world display driver IC market. The display driver ICs have been classified into 3 segments. This study gives an indepth analysis of the challenges, market drivers, restraints and technological trends at segment level. Market forecast has been done with the base year as 2005 and a forecast period of 2006-2009. Individual e...
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22 Nov 2021  |  Global  |  Technology Research
Emerging Growth Opportunities for Low-Power Integrated Circuits and Radio Frequency (RF) Technologies
Low-Power Design Advancements Supported by Emerging RF Standards Accelerate Future Growth Potential in Internet of Things (IoT) Applications
Power-efficient electronic devices capable of high-speed communication have become essential in today’s electronics-dominated world. Low-power integrated circuits (IC) and radio frequency (RF) technologies have evolved rapidly following the increase in portable electronics and internet of things (IoT) usage. Circuit design advancements, such as sub...
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03 Feb 2026  |  Global  |  Technology Research
Technological Advancements in 3D Integrated Circuits (3D ICs) Transforming the Semiconductor Industry
Unlocking Next-Generation Performance and Growth in Semiconductor Packaging
3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...
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30 Sep 2019  |  Global  |  Technology Research
Sensors for Homeland Security: Global Opportunity Assessment
Nanosensors, Acoustic Sensors, CBRNe Sensors, Multi-Sensor Integration, Improved Standoff Detection, and Integrated Communications Drive Opportunities for Homeland Security
Sensors have the potential to transform any industry owing to the various benefits associated with them. Traditionally, different types of sensors have been deployed for homeland security, which are however undergoing advancements to develop newer technologies such as electronic noses (e-noses) and electronic tongues (e-tongues), which have the cap...
$4,950.00