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With the growing market for electronics and increasing complexities of the appliances it is necessary to build the skilled workforce. Majority of the servicing of consumer appliances is done mostly by the unorganized segment creating the need to move them to organized arena. Manpower deficit, outdated curriculum coupled with high attrition and lack...

18 Jun 2020  |  Global  |  Market Research

Analysis of the Global Time and Attendance Solutions Market, Forecast to 2024

Biometric-based Time and Attendance Solutions will Grow Rapidly due to the Increase in Adoption of Remote Working in the Near Futu

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In 2019, the global time and attendance solutions market raked in $1,776.3 million in terms of revenue, and the market is expected to grow at a compound annual growth rate (CAGR) of 5.8% between 2019 and 2024. North America (NA) was the largest regional market for time and attendance solutions, holding 25.5% of the global revenue. The region is exp...

Hybrid vision systems (HVS) are positioned to substantially impact perception-driven applications across a diverse array of sectors, including robotics, manufacturing, logistics, mobility, surveillance, and agriculture. By intricately combining the geographical precision of LiDAR with the semantic intelligence of advanced imaging systems, these inn...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to AI Processors, Silicon Photonics, SoCs and Chiplets among others.The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power a...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Sub-1 Nm Chip technology, MMIC, SOC, Photonic Chiplet, GaN and Power Electronics among others.The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electron...

This study focuses on heterogeneous computing architectures for automotive and robotics applications, examining how centralized and zonal compute architectures, heterogeneous SoCs integrating CPUs, GPUs, NPUs, DSPs, FPGAs, and dedicated safety islands, as well as robotics edge-AI controllers and mixed-criticality computing platforms, are enabling t...

The escalating compute and power demands of edge AI are exposing the limits of conventional von Neumann architectures. Manufacturers deploying always-on sensing, real-time inference, and autonomous decision-making at the edge are constrained by the energy, latency, and memory-bandwidth ceilings of standard NPUs and MCUs. Traditionally, edge AI work...