Search results for: 'MOLDED INTERCONNECT DEVICE'

This series offers a comprehensive overview of the latest advancements and transformative trends that companies worldwide have embraced to develop technologies for a new era of mobility. These trends create direct opportunities for companies in sectors such as mobility, supply chain & logistics, health, medical devices & life sciences, aerospace & ...

27 Jun 2017  |  Global  |  Market Research

Strategic Analysis of Waymo's Future Autonomous Disruptive Capabilities for the Automotive Industry

Synergy with Google Holds the Key to Completing the Connected Devices Ecosystem for Alphabet Inc.

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Waymo, the autonomous technology company under the Alphabet conglomerate, is at the forefront of developing autonomous driving software for cars. Vehicles powered by Waymo's software help Alphabet complete its ecosystem of connected devices by serving as a data collection node when users are on the move. In a steadfast effort to enter the automotiv...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

Video telematics solutions are poised to become the norm amongst enterprise fleets in the initial phase, owing to reduced vehicle claims, efficient driver exoneration, and higher realized return on investment. Medium and heavy-duty commercial vehicles for long-haul vehicle operations are primarily poised to be early adopters of video telematics, gi...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...

The energy transition is no longer driven solely by cleaner generation technologies; it is increasingly defined by the intelligence, resilience, and strategic control embedded within energy systems. As governments, utilities, infrastructure operators, and industrial stakeholders respond to rising electricity demand, supply chain volatility, and dec...

This study focuses on heterogeneous computing architectures for automotive and robotics applications, examining how centralized and zonal compute architectures, heterogeneous SoCs integrating CPUs, GPUs, NPUs, DSPs, FPGAs, and dedicated safety islands, as well as robotics edge-AI controllers and mixed-criticality computing platforms, are enabling t...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

Chiplet-based compute architectures for vehicles are entering a new phase, reshaping SDV hardware roadmaps by enabling modular multi-die platforms that scale performance, improve yield, and accelerate refresh cycles while meeting long lifecycles, safety, and cybersecurity requirements. This Frost & Sullivan study examines how automakers, Tier 1s, s...