Search results for: 'systems modules markets'

The Microelectronics Technology Opportunity Engine covers innovations pertaining to SiC Power Modules, AI SoCs, GaN, Edge AI and Photonics among others.The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low po...

Hybrid vision systems (HVS) are positioned to substantially impact perception-driven applications across a diverse array of sectors, including robotics, manufacturing, logistics, mobility, surveillance, and agriculture. By intricately combining the geographical precision of LiDAR with the semantic intelligence of advanced imaging systems, these inn...

Multimodal sensor fusion is an advanced perception technology that combines data from multiple sensors, including cameras, LiDAR, radar, ultrasonic sensors, thermal cameras, and inertial measurement units (IMUs), to give robots and autonomous systems a more accurate, reliable, and comprehensive understanding of their environment. It overcomes the l...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to High-Efficiency Power Module for Reliable AI at the Edge Performance, Programmable USB Peripheral Controller to Create USB Devices, Compact AI Supercomputer Platform, Ultra-Wide Band Transceiver, Advanced TPU AI Inference Chip, and Space-based 5G Connection.The Micr...

The study aims to analyze the Indian connected lighting systems market. It highlights the trends in the 4 major user segments: · Residential · Commercial · Industrial · Government This document introduces the 3 categories of connected lighting, namely, basic, intermediate, and advanced and then goes on to explain the advantages offered by intell...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

24 Jul 2024  |  Global  |  Technology Research

Radar R&D Portfolio Assessment and Opportunity Analysis

Millimeter-Wave Radar and Radar-on-Chip Solutions are Driving Market Growth

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Radar technology will experience rapid growth because of improvements in enabling technologies and growing demand in the automotive, defense, aerospace, consumer electronics, manufacturing, and energy industries. The technology has diverse applications and use is expanding with the adoption of IoT devices and penetration of 5G technology. The lo...

Advanced edge AI sensors solutions are rapidly transforming industrial operations by integrating adaptability, intelligence, and precision into core processes across various sectors, including consumer electronics, manufacturing, automotive, and agriculture. Continuous advancements in sensor hardware and AI-based decision-making are reshaping the c...