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Microelectronics Technology Opportunity Engine
09-May-2025
Global
Technology Research
D777-00-F2-00-00
AE_2025_33723
The Microelectronics Technology Opportunity Engine covers innovations pertaining to High-Efficiency Power Module for Reliable AI at the Edge Performance, Programmable USB Peripheral Controller to Create USB Devices, Compact AI Supercomputer Platform, Ultra-Wide Band Transceiver, Advanced TPU AI Inference Chip, and Space-based 5G Connection.
The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).
Keywords: Power Modules, Programmable USBs, UWB Transceiver, AI Inference Chip, and Silicon Photonic Chip, 5G, Supercomputer, AI edge.
Microchip Technology, United States
QpiAI, India
University of Rochester, United States
Massachusetts Institute of Technology MIT, United States
GigaIO, United States
SPARK Microsystems, Canada
Google, United States
Smiths Interconnect, United Kingdom
Fudan University, China
Rutgers University, United States
Analog Devices, United States
Eutelsat, France
Sarcina Technology, United States
TSMC, Taiwan
xMEMS Labs, Inc., United States
Synaptics Incorporated, United States
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The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).
Keywords: Power Modules, Programmable USBs, UWB Transceiver, AI Inference Chip, and Silicon Photonic Chip, 5G, Supercomputer, AI edge.
| Deliverable Type | Technology Research |
|---|---|
| Industries | Aerospace, Defence and Security |
| No Index | No |
| Is Prebook | No |
| Podcast | No |
| Predecessor | D777-00-F1-00-00 |
| WIP Number | D777-00-F2-00-00 |
Growth Opportunities in Power Modules, Programmable USBs, UWB Transceiver, AI Inference Chip, and Silicon Photonic Chip
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