Search results for: '20 packaging'

The Microelectronics Technology Opportunity Engine provides profiles of innovations related to Novel Ultrathin LPDDR5X DRAM Packages, Compute Express Link (CXL) Memory Module, Low-loss Glass in Semiconductor Manufacturing and Advanced Semiconductor Packaging material.The Microelectronics Technology Opportunity Engine captures global electronics-rel...

This research service focuses on key semiconductor types enabling 5G connectivity in devices and network infrastructure. The key components included are Modem ICs/SoC, RFICs, power amplifiers (PA), filters, low noise amplifiers (LNAs), beamformer ICs, switches, and envelope trackers, among others. End-user applications include smartphones, network ...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...