Test and Measurement Instrumentation Growth Opportunities in DRAM, AI Processors, Semiconductor Manufacturing and Memory Modules

SECTOR
Security

RELEASE DATE
13-Sep-2024
REGION
Global
DELIVERABLE TYPE
Technology Research

RESEARCH CODE
D777-00-EA-00-00
SKU
TM_2025_33613
Yes
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Growth Opportunities in DRAM, AI Processors, Semiconductor Manufacturing and Memory Modules
Published on: 13-Sep-2024 | SKU: TM_2025_33613

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The Microelectronics Technology Opportunity Engine provides profiles of innovations related to Novel Ultrathin LPDDR5X DRAM Packages, Compute Express Link (CXL) Memory Module, Low-loss Glass in Semiconductor Manufacturing and Advanced Semiconductor Packaging material.



The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).



Keywords: DRAM, memory, semiconductor manufacturing, semiconductor packaging, LPDDR


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The Microelectronics Technology Opportunity Engine provides profiles of innovations related to Novel Ultrathin LPDDR5X DRAM Packages, Compute Express Link (CXL) Memory Module, Low-loss Glass in Semiconductor Manufacturing and Advanced Semiconductor Packaging material.



The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).



Keywords: DRAM, memory, semiconductor manufacturing, semiconductor packaging, LPDDR
More Information
Deliverable Type Technology Research
Industries Test and Measurement Instrumentation
No Index No
Is Prebook No
Podcast No
WIP Number D777-00-EA-00-00

Growth Opportunities in DRAM, AI Processors, Semiconductor Manufacturing and Memory Modules

$950.00

Special Price $807.50 save 15 %

In stock
SKU
TM_2025_33613