Search results for: '2020 packaging'

The Microelectronics Technology Opportunity Engine provides profiles of innovations related to Novel Ultrathin LPDDR5X DRAM Packages, Compute Express Link (CXL) Memory Module, Low-loss Glass in Semiconductor Manufacturing and Advanced Semiconductor Packaging material.The Microelectronics Technology Opportunity Engine captures global electronics-rel...

This research service focuses on key semiconductor types enabling 5G connectivity in devices and network infrastructure. The key components included are Modem ICs/SoC, RFICs, power amplifiers (PA), filters, low noise amplifiers (LNAs), beamformer ICs, switches, and envelope trackers, among others. End-user applications include smartphones, network ...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

Frost & Sullivan’s semiconductor program aims to provide a comprehensive view of emerging markets, from design to packaging, while identifying the strategic imperatives, market projections, growth opportunities, and calls to action that market participants and value chain partners will need to plot their growth and innovation strategies. In this...