Search results for: 'complex needs'

The North American medium and heavy-duty commercial vehicle (CV) electronic service tools (EST) market is experiencing gradual and sustained growth, driven by interesting industry dynamics, such as advancements in vehicle complexity, a growing focus on vehicle efficiency and fuel economy, the increasing demand for a well-rounded fleet management pa...

The global passenger vehicle door module market is undergoing a structural transformation, driven by increasing vehicle complexity, cost pressures, and the shift toward software-defined architectures. Traditionally viewed as mechanical assemblies, door modules are evolving into integrated, technology-rich systems that combine hardware, electronics,...

10 Sep 2019  |  Global  |  Market Research

2025 Vision of Truck Telematics Market

Burgeoning Need for Data Intelligence to Enable New Revenue Streams

Infographics

×

Key Issues Addressed

The fleet telematics industry is undergoing significant transformation in terms of ‘platformization’, digitalization, and data-driven business models. This transformation in the industry is set to open revenue opportunities for vendors as they diversify into new service-related revenue streams. Major telematics vendors have understood the need for ...

The automotive industry is experiencing a significant transformation, transitioning from conventional to software-defined vehicles. As vehicles develop into intelligent, connected platforms driven by electrification, autonomous driving technologies, and digital services, traditional original equipment manufacturers (OEMs) are confronted with increa...

The global steer-by-wire (SbW) market is expected to grow despite the technology itself being over a decade old. Early adopters, including Infiniti and Tesla, as well as premium segment EV manufacturers, introduced SbW systems years ago; however, penetration in the mass market has been slow. This is largely due to high system costs, the need for ro...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

In 2026, the global ADAS and autonomous driving market is transitioning to standardization, with Level 1 and Level 2 features becoming baseline across vehicle segments. This shift is driven by regulatory frameworks in North America and Europe, along with rising consumer demand for vehicle safety in emerging markets such as India and Southeast Asia....

The additive manufacturing sector has seen significant growth in recent years owing to growing demand for customized products and complex geometries in various sectors, including automotive, defense, aerospace, consumer electronics, manufacturing, and energy. AI has a wide range of applications in additive manufacturing at various levels and is a k...

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...