Search results for: 'plan on package'

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

This study focuses on heterogeneous computing architectures for automotive and robotics applications, examining how centralized and zonal compute architectures, heterogeneous SoCs integrating CPUs, GPUs, NPUs, DSPs, FPGAs, and dedicated safety islands, as well as robotics edge-AI controllers and mixed-criticality computing platforms, are enabling t...

Chiplet-based compute architectures for vehicles are entering a new phase, reshaping SDV hardware roadmaps by enabling modular multi-die platforms that scale performance, improve yield, and accelerate refresh cycles while meeting long lifecycles, safety, and cybersecurity requirements. This Frost & Sullivan study examines how automakers, Tier 1s, s...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...

The North American trailer telematics market has been active for more than a decade with fierce competition among its market participants. Despite its long presence, the market remains largely fragmented, and the competition is too intense for any considerable market consolidation to happen. However, the market is currently witnessing an influx of ...

The North American medium and heavy-duty commercial vehicle (CV) electronic service tools (EST) market is experiencing gradual and sustained growth, driven by interesting industry dynamics, such as advancements in vehicle complexity, a growing focus on vehicle efficiency and fuel economy, the increasing demand for a well-rounded fleet management pa...

12 May 2020  |  Europe  |  Market Research

Strategic Analysis of European OEMs’ Connected Services and HMI Solutions

Telematics Services are Expected to Achieve a Penetration of 90% in Europe, While More Than 60% of Vehicles will have Wider (12.3+ inch) Infotainment Displays Controlled by Touch or Gestures, with AI-based Digital Assistants being Omnipresent, by 2025

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Connected car strategy for the in-vehicle scenario covers 2 major domains—Connected Services and Human-Machine Interfaces (HMI)—apart from other domains that are also important. Each automaker’s portfolio defines its position in the fight to be a market leader in the connected car segment. This connected services and HMI study for the European reg...