Search results for: 'plan on packaged'

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

This study focuses on heterogeneous computing architectures for automotive and robotics applications, examining how centralized and zonal compute architectures, heterogeneous SoCs integrating CPUs, GPUs, NPUs, DSPs, FPGAs, and dedicated safety islands, as well as robotics edge-AI controllers and mixed-criticality computing platforms, are enabling t...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

Chiplet-based compute architectures for vehicles are entering a new phase, reshaping SDV hardware roadmaps by enabling modular multi-die platforms that scale performance, improve yield, and accelerate refresh cycles while meeting long lifecycles, safety, and cybersecurity requirements. This Frost & Sullivan study examines how automakers, Tier 1s, s...

The COVID-19 pandemic has placed a greater emphasis on a safe environment and exacerbated the need for more convenience in daily activities. The automotive industry has aligned itself with this trend, focusing on solutions and systems that enhance the safety and comfort of drivers and passengers. This study aims to support automakers and allied ind...

This Frost & Sullivan analysis outlines the strategic imperatives, growth drivers, and constraints influencing the rear-seat entertainment (RSE) ecosystem. Principal drivers include increasing consumer demand for premium in-cabin experiences, advancements in display technologies, and the expansion of 5G-enabled content ecosystems. Key restraints in...

The North American trailer telematics market has been active for more than a decade with fierce competition among its market participants. Despite its long presence, the market remains largely fragmented, and the competition is too intense for any considerable market consolidation to happen. However, the market is currently witnessing an influx of ...