Search results for: 'transformers edg'

The edge AI accelerator market is scaling rapidly as industries demand low-latency, privacy-aware intelligence for autonomous vehicles, industrial automation, smart cameras, robotics, and other applications. Cloud-based inference faces more limits from bandwidth, latency, and data sovereignty concerns, creating a strong pull for on-device AI proces...

This study focuses on heterogeneous computing architectures for automotive and robotics applications, examining how centralized and zonal compute architectures, heterogeneous SoCs integrating CPUs, GPUs, NPUs, DSPs, FPGAs, and dedicated safety islands, as well as robotics edge-AI controllers and mixed-criticality computing platforms, are enabling t...

The global video telematics market is on a robust growth trajectory, driven by fleets upgrading from traditional fleet management systems to advanced video-enabled solutions. For many providers, video telematics has evolved from just being a peripheral product into a core revenue driver for fleet operators. The tangible benefits of investing in vid...

Advanced robotics and autonomous systems (RAS) are rapidly transforming industrial operations by integrating adaptability, intelligence, and precision into core processes across various sectors, including healthcare, manufacturing, automotive, and agriculture. Continuous advancements in hardware and AI-based decision-making are reshaping the capabi...

Research Scope In 2015, automotive industry investments in key focus areas were about $19.57 billion. Growing digitalization and advancements in technology will increase the investments to $82.01 billion by 2020. The rapid pace of digitalization is transforming the component hardware-driven automotive sector to a software and solutions-focused ind...

The Mobility Technology Opportunity Engine (TOE) covers innovations pertaining to Air Taxi, Electric Vehicles, Autonomous Mobility, Radar and Diesel Engines. Some of the innovations profiled include Autonomous Electric Air Taxi for Urban Air Mobility, Advanced 3D Mapping and Object Detection System for Autonomous Vehicles, Intelligent Operating Sys...

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

India’s urban mobility landscape is undergoing a structural transformation driven by rising urbanization, policy mandates, digital ecosystems, and growing consumer demand for affordable and sustainable transport. This study presents a comprehensive and forward-looking analysis of the Indian shared mobility market, offering stakeholders a data-backe...