Search results for: 'Semiconductor end market'

This issue of the Nanotechnology Opportunity Engine highlights technology developments related to innovations in nanomaterials for healthcare, semiconductors, and consumer goods. Innovations related to conductive nanoinks, nanomanufacturing, nano-titanium dioxide, nanoencapsulation, nanocatalysts, single walled nanotubes, and nanoparticle-assisted ...

This end-user survey shows current adoption statistics of technologies used in multi-channel contact centers. Investment plans in multi-channel contact technologies for the future are also indicated. The results are based on a web-based survey conducted by Frost & Sullivan.

A MAC is a one-stop solution provider catering to all of an end users automation needs. The MAC assumes responsibility for all automation-related functions of a project. This market insight provides an overview of the MAC model and its advantages over the conventional multi-vendor approach adopted by end-users in Southeast Asia, Australia, and New...

Catalysts are chemicals/materials that facilitate an increase in the rate of a chemical reaction. These chemicals do not actively take part in the chemical reaction but bring about an increase in the reaction rate by lowering the activation energy in the system. There is a significant surge in demand for catalysts in the market, which can be attrib...

Oleochemicals are basic raw materials for soaps and detergents. They are also used as stabilizers and plasticizers in the plastics industry and are mainly used in the form of derivatives such as surfactants, fatty acid metal salts, and fatty acid esters in end-user applications. Fatty acids are used in the synthesis of chemical intermediates such a...

In this report, Frost & Sullivan has presented the key findings of it survey conducted among European enterprises on their preferences for SD-WAN. A survey was conducted among the IT/ Network decision makers across various verticals such as financial services, healthcare, retail, government, technology and manufacturing in the European market. The ...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

This market insight discusses current and future trends, 2009 outlook, and buyer behavior in the contact center market. The research findings are based on a comprehensive end-user survey conducted by Frost & Sullivan. We targeted 332 Contact Center decisions makers, based primarily in North America; specifically, those who manage, support or influe...