Search results for: 'Connection system'

Investments in oil and gas (O&G) automation declined in 2020 and 2021 as demand dried up because of the COVID-19 pandemic. From 2021 onward, the market began gradually stabilizing and recovering, with high levels of growth starting in 2022. Industry 4.0 is driving the demand for new technology investments and has transformed the O&G value chain...

Quantum sensing is transitioning from laboratory research to industrial deployment, driven by the need for ultra-precise, reliable measurement in high-impact sectors such as healthcare, defense, and advanced manufacturing. This shift reflects a broader move from controlled, research-grade environments toward scalable, field-ready systems that meet ...

Frost & Sullivan expects North America’s school bus market to experience steady, multiyear, replacement-driven growth, supported by an aging national fleet, rising safety requirements, and expanding state-level investment in clean student transportation. While established manufacturers continue to dominate in production scale, dealer reach, and mul...

21 Dec 2023  |  North America  |  Market Research

Global Healthcare Data Interoperability Growth Opportunities Forecast to 2028

Systems to Move Beyond Integration Toward Semantic Interoperability

Infographics

×

Interoperability refers to the ability to exchange data among different systems or applications and make use of the incoming data. In healthcare, this generally means the ability to share data between electronic health record (EHR) systems and other health IT applications, such as a clinical decision support system (CDSS), computerized physician or...

The mobility industry is witnessing widespread change. Over the last decade or so, existing solutions and archaic models within the automotive industry have been confronted by auto-tech solutions and new business models that are set to transform the way people commute from point A to point B. Recent trends in artificial intelligence, machine learni...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

This study examines key original equipment (OE) suppliers' aftermarket strategies in the rapidly evolving automotive connected, autonomous, shared, and electric (CASE) domain. Spanning Europe (including the 27 European Union countries and the United Kingdom), North America (the United States and Canada), and China, the focus is on 2023 to 2030. The...

Government and consumers are concerned about cyber security in cars, as researchers were able to hack into various OEM models in 2015. This research service identifies key areas that offer scope for technology innovation and discusses cybersecurity initiatives for the automotive industry. In 2015, cybersecurity, secure data transfers, and data priv...