Search results for: 'packaging markets'

The packaging industry is developing next-generation barrier coatings to meet the evolving needs of market applications, product and consumer safety procedures, and compliance regulations. The emergence of new materials leads to innovations in technology and the development of new barrier coatings. The research offers a snapshot of emerging and ...

This issue of High-Tech Materials Technology Opportunity Engine (TOE) profiles significant advances in high-technology materials for various industrial applications. The featured innovations include Cellulose-based Foams for Sustainable Packaging, Advancing Circular Packaging Through Textile Waste Innovation, Valorizing Silkworm Pupae Waste into Hi...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics. Some of the innovations profiled include Chips on Panel on Substrate Advanced Chip Packaging for Next-Gen AI Systems, Room-Temperature Printable Ink for Adaptive Electronics, GaN for Ultra-Fast 6G...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

The circular economy approach involves initiatives across material and product life cycles, supporting sustainable resource consumption and waste prevention by assimilating high-tech solutions. The global resource management sector is transitioning toward greater digital technology adoption using disruptive smart technologies and platform-based sol...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Processors, Packaging, Transceivers, Wireless Connectivity and Thermal Management.The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attribut...

This Frost & Sullivan analysis assesses the growth opportunities across the food processing and packaging equipment market. The application areas considered include beverages; fruits and vegetables; dairy; meat, fish, and poultry; bakery and confectionary; oils and fats; breakfast cereals, and snacks; and pet food. The equipment scope includes all ...

This edition of the Industrial Bioprocessing TOE features information on innovations in carbon removal and sequestration, direct air capture, wood valorization, high-performance bioplastics, bio-based crop protection, sustainable packaging, and sustainable protein production, among others.The Industrial Bioprocessing TOE provides intelligence on te...

Dumping of plastics in landfills and in marine environment are having adverse effects across the globe. Also, microplastics found in most of the water sources, affects both human and marine life. The current widely adopted crude-based plastics are degraded to reduce its adverse impact. However, degradation of plastics also requires energy intensive...