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This issue of High-Tech Materials Technology Opportunity Engine (TOE) profiles significant advances in high-technology materials for various industrial applications. The featured innovations include Cellulose-based Foams for Sustainable Packaging, Advancing Circular Packaging Through Textile Waste Innovation, Valorizing Silkworm Pupae Waste into Hi...

27 Jul 2016  |  Europe  |  Market Research

Analysis of the European Packaging and Plastic Processing Machinery Market

Cost-Efficient, Intuitive, and Flexible Solutions to Stimulate Demand

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The research on the packaging and plastic processing machinery market offers extensive analysis of the various product segments across the European market. It assesses the strategic opportunities that machinery manufacturers can leverage to expand their current product/service mix. With changing customer requirements, the demand is shifting towards...

The circular economy approach involves initiatives across material and product life cycles, supporting sustainable resource consumption and waste prevention by assimilating high-tech solutions. The global resource management sector is transitioning toward greater digital technology adoption using disruptive smart technologies and platform-based sol...

The European ride-hailing market is rapidly evolving, shaped by technological advancements, changing consumer preferences, and regulatory dynamics. While Uber and Bolt are the formidable players, local and regional competitors such as FreeNow, Cabify, inDrive, Yango Ride, Heetch, and Blacklane have their own strengths and specific regions of operat...

This study provides an analysis of the packaging machinery market in Europe. Despite being affected by the economic recession, the market has rebounded. This indicates growth opportunities over the forecast period. This study covers the drivers and restraints of the market and divides it into FCFC, FFS, grouping, wrapping, palletizing, and other pa...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Processors, Packaging, Transceivers, Wireless Connectivity and Thermal Management.The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attribut...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics. Some of the innovations profiled include Chips on Panel on Substrate Advanced Chip Packaging for Next-Gen AI Systems, Room-Temperature Printable Ink for Adaptive Electronics, GaN for Ultra-Fast 6G...

Dumping of plastics in landfills and in marine environment are having adverse effects across the globe. Also, microplastics found in most of the water sources, affects both human and marine life. The current widely adopted crude-based plastics are degraded to reduce its adverse impact. However, degradation of plastics also requires energy intensive...

Food packaging is a relatively new domain. Only a few decades ago, the most commonly used packaging material was brown paper. Even about 60 years ago, butter, bacon, and biscuits were sold without packaging. Grocers weighed the quantities customers wanted and wrapped the food well enough for it to be transported home safely. Motor and industrial oi...