Search results for: 'rigid packaging'

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics. Some of the innovations profiled include Chips on Panel on Substrate Advanced Chip Packaging for Next-Gen AI Systems, Room-Temperature Printable Ink for Adaptive Electronics, GaN for Ultra-Fast 6G...

Dumping of plastics in landfills and in marine environment are having adverse effects across the globe. Also, microplastics found in most of the water sources, affects both human and marine life. The current widely adopted crude-based plastics are degraded to reduce its adverse impact. However, degradation of plastics also requires energy intensive...

This Frost & Sullivan analysis assesses the growth opportunities across the food processing and packaging equipment market. The application areas considered include beverages; fruits and vegetables; dairy; meat, fish, and poultry; bakery and confectionary; oils and fats; breakfast cereals, and snacks; and pet food. The equipment scope includes all ...

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...

This edition of the Industrial Bioprocessing TOE features information on innovations in carbon removal and sequestration, direct air capture, wood valorization, high-performance bioplastics, bio-based crop protection, sustainable packaging, and sustainable protein production, among others.The Industrial Bioprocessing TOE provides intelligence on te...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

This issue of High-Tech Materials Technology Opportunity Engine (TOE) profiles significant advancements in high-tech materials for various enhanced industrial applications. The featured innovations include Recycling Polystyrene to Produce Sustainable Surface Materials, Seaweed-based Sustainable and Biodegradable Packaging, High-performance Plant-ba...

This edition of the Advanced Coating & Surface Technology Opportunity Engine profiles significant advances in advanced coatings and surface treatments for various industrial applications. The featured innovations include Polyurethane-based Lamination System to Improve Packaging Sustainability, Advanced Intumescent Fire Protection Coatings with Pass...

This edition of the Advanced Coating & Surface Technology Opportunity Engine profiles significant advancements in high-tech materials for various enhanced industrial applications. The featured innovations include Roll-to-Roll System for Ultra-thin Lithium Film Deposition in Battery Manufacturing, Humidity-responsive UV Protection Film for Adaptive ...