Search results for: 'soc print semiconductor smart'

Frost & Sullivan’s semiconductor program aims to provide a comprehensive view of emerging markets, from design to packaging, while identifying the strategic imperatives, market projections, growth opportunities, and calls to action that market participants and value chain partners will need to plot their growth and innovation strategies. In this...

The Advanced Manufacturing Technology Opportunity Engine provides profiles of innovations related to Extrusion Based 3D Printer for Large-scale Additive Manufacturing, AI/ML Based System for Optimized Ceramic 3D Printing, AI Enabled High Precision Robot, Advanced Autonomous Mobile Robot for Efficient Material Handling, Phase Transition Actuation Ba...

The research report analyzes the market opportunities for additive manufacturing (AM), also known as 3D printing, in the semiconductor industry. The study discusses technological development, including semiconductor 3D printing innovations. It elaborates on the market trends and drivers and charts the expected evolution of this technology in the se...

This report examines the expanding role of smart contracts in city services, beginning with a foundational overview of blockchain technology and smart contracts, including their core principles and applications across various industries. Anchored by Frost & Sullivan’s top three strategic imperatives, the report examines how these technologies are r...

13 Oct 2023  |  Global  |  Market Research

Global Outsourced Semiconductor Assembly and Test Growth Opportunities

Increasing Adoption of Advanced Packaging and the Need for Cost-effective ATP Solutions will Fuel Transformational Growth

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This study analyzes the global outsourced semiconductor assembly and test (OSAT) market, which is set to experience substantial growth driven by the increasing adoption of advanced packaging technology across various industries. OSATs are third-party providers that specialize in assembly, testing, and packaging (ATP) services and cater to integrate...

This global smart electricity meter market research provides insights into the latest developments in the market, including forecasts on unit shipment and associated revenue for all major regions. The global smart meter market was affected in 2020 and 2021 by pandemic-induced delays and disruptions and supply chain bottlenecks brought on by a globa...

The Mobility Technology Opportunity Engine (TOE) covers innovations pertaining to SoC, LiDAR, Urban Mobility and Self-driving Systems, among others.The purpose of the Mobility Technology TOE is to raise awareness of global technology innovations in self-propelled ground-based mobile platforms that are not only technically significant but potentiall...

The Mobility Technology Opportunity Engine (TOE) covers innovations pertaining to Battery Intelligence, SoCs, Image Sensors, LiDAR and V2X among others.The purpose of the Mobility Technology TOE is to raise awareness of global technology innovations in self-propelled ground-based mobile platforms that are not only technically significant but potent...

Wide-bandgap (WBG) semiconductors—primarily consisting of silicon carbide (SiC) and gallium nitride (GaN)-based devices—are a sub-set of compound semiconductors. WBG semiconductors are at an early stage of commercialization and exhibit significant growth projections over the next 10 years. For this reason, various integrated device manufacturers (...