Global Outsourced Semiconductor Assembly and Test Growth Opportunities

Global Outsourced Semiconductor Assembly and Test Growth Opportunities

Increasing Adoption of Advanced Packaging and the Need for Cost-effective ATP Solutions will Fuel Transformational Growth

RELEASE DATE
13-Oct-2023
REGION
Global
Deliverable Type
Market Research
Research Code: K901-01-00-00-00
SKU: ES_2023_225
AvailableYesPDF Download
$4,950.00
In stock
SKU
ES_2023_225
$4,950.00
DownloadLink
ENQUIRE NOW

Description

This study analyzes the global outsourced semiconductor assembly and test (OSAT) market, which is set to experience substantial growth driven by the increasing adoption of advanced packaging technology across various industries. OSATs are third-party providers that specialize in assembly, testing, and packaging (ATP) services and cater to integrated device manufacturers (IDMs), foundries, and fabless chip manufacturers. They offer expertise in both advanced and conventional packaging and testing, benefiting from economies of scale due to their high-volume manufacturing capabilities. By outsourcing backend manufacturing processes to OSATs, chip manufacturers can focus on their core competencies and experience faster turnaround times and reduced time-to-market.

This study focuses on pure-play OSATs and foundries offering packaging and testing services, excluding IDMs with in-house packaging capabilities. The research delves into market estimates and forecasts based on the revenue generated by OSATs and foundries through ATP services. The study analyzes end-user industries in detail, outlining the potential OSATs hold for enabling transformative trends like electric mobility, 5G deployments, and the Internet of Things (IoT) through advanced packaging technologies. Additionally, it examines the impact of industry consolidation and geopolitical factors on the OSAT market.

The primary goal of this study is to identify growth opportunities emerging from this space and assess factors that may accelerate or hinder market growth. It examines market segments based on end-user industries, packaging technology, interconnect type, and geography. The research includes findings from discussions with industry experts and stakeholders in the OSAT ecosystem, complemented by secondary research, to estimate market size and forecast growth up to 2027. Some of the key study highlights include insights into demand patterns across different regions and a comprehensive analysis of each end-user sector's OSAT opportunities. Additionally, the study examines the capital expenditure trend, the distribution of OSAT facilities, and the value chain of OSAT. The report also contains a competitive analysis, providing market shares for major players.

Author: Navdeep Saboo

RESEARCH: INFOGRAPHIC

This infographic presents a brief overview of the research, and highlights the key topics discussed in it.
Click image to view it in full size

Table of Contents

Why is it Increasingly Difficult to Grow?

The Strategic Imperative 8™

The Impact of the Top 3 Strategic Imperatives on the Outsourced Semiconductor Assembly and Test (OSAT) Industry

Growth Opportunities Fuel the Growth Pipeline Engine™

Scope of Analysis

Classification of Semiconductor Packaging Technology

Classification of Semiconductor Packaging Technology (continued)

Classification of Semiconductor Packaging Technology (continued)

Classification of Semiconductor Packaging Technology (continued)

Classification of Semiconductor Packaging Technology (continued)

Classification of Semiconductor Packaging Technology (continued)

Classification of Semiconductor Packaging Technology (continued)

Key Participants in the OSAT Value Chain

Key Participants in the OSAT Value Chain (continued)

Segmentation by End Users

The Rise of Chiplets

Packaging Trends in Wide-bandgap (WBG) Semiconductors

Packaging Trends in WBG Semiconductors (continued)

Hybrid Bonding

Key Competitors

Growth Metrics

Growth Drivers

Growth Driver Analysis

Growth Driver Analysis (continued)

Growth Driver Analysis (continued)

Growth Driver Analysis (continued)

Growth Restraints

Growth Restraint Analysis (continued)

Growth Restraint Analysis (continued)

Growth Restraint Analysis (continued)

Growth Restraint Analysis

Growth Restraint Analysis (continued)

Forecast Assumptions

Revenue Forecast

Revenue Forecast by End User

Revenue Forecast by Packaging Type

Revenue Forecast by Interconnect Type

Packaging Interconnect Technologies—Global Market Share of OSATs, IDMs, and Foundries

Revenue Forecast by Region

OSAT Facilities by Region

Revenue Forecast Analysis

Revenue Forecast Analysis (continued)

Pricing Trends and Forecast Analysis

Pricing Trends and Forecast Analysis (continued)

Competitive Environment

Revenue Share

Revenue Share Analysis

Revenue Share Analysis (continued)

OSAT Landscape—Capex Trend

OSAT Landscape—Analysis of Top 25 Pure-play OSATs

Notable ATMP Investments Globally

Notable ATMP Investments Globally (continued)

ATMP Investment Landscape, 2020–2023

OSATs’ Recipe for Success

Analysis of Competition

Analysis of Competition (continued)

M&A Analysis

M&A Analysis (continued)

M&A Analysis (continued)

Indian Semiconductor Industry

Indian Semiconductor Policy

Indian Semiconductor Policy (continued)

Revenue Forecast—Indian ATMP Landscape

Revenue Forecast Analysis—ATMP Market

Indian OSAT Opportunities

Indian ATMP Landscape—Current Scenario

Indian ATMP Landscape—Current Scenario (continued)

India ATMP Capabilities

Developments in the Indian ATMP Sector

Key Pillars for Implementation of Smart Manufacturing in OSATs

AI/ML in Semiconductors Packaging and Testing

Existing and Potential AI/ML Solutions for the OSATs/ATMP Landscape

Existing and Potential AI/ML Solutions for the OSATs/ATMP Landscape (continued)

Existing and Potential AI/ML Solutions for the OSATs/ATMP Landscape (continued)

Notable AI/ML Solutions for ATMP—Impact Analysis Dashboard

Notable AI/ML Solutions for ATMP—Impact Analysis (continued)

Case #1: End-to-End Software Solution for Efficient OSAT Operations

Case #2: Exensio OSAT by PDF Solutions

Growth Metrics

Revenue Forecast

Revenue Forecast by Interconnect Type

Revenue Forecast by Packaging Type

Revenue Forecast by Region

Forecast Analysis

Forecast Analysis (continued)

AiP for 5G

Evolution of RF FEM, Antenna, and Packaging Technology in Smartphones with Network Generations

Competitive Environment

Revenue Share

Growth Metrics

Revenue Forecast

Revenue Forecast by Interconnect Type

Revenue Forecast by Packaging Type

Revenue Forecast by Region

Forecast Analysis

Forecast Analysis (continued)

Global 5G Adoption—2021 and 2025

Competitive Environment

Revenue Share

Growth Metrics

Revenue Forecast

Revenue Forecast by Interconnect Type

Revenue Forecast by Packaging Type

Revenue Forecast by Region

Forecast Analysis

Forecast Analysis (continued)

Competitive Environment

Revenue Share

Growth Metrics

Revenue Forecast

Revenue Forecast by Interconnect Type

Revenue Forecast by Packaging Type

Revenue Forecast by Region

Forecast Analysis

Forecast Analysis (continued)

Competitive Environment

Revenue Share

Top 5 Trends in the Semiconductor Ecosystem for Sustainability and the Circular Economy

Semiconductor Ecosystem Alignment with UN SDGs Critical to Paving the Path to Decarbonization

Key Sustainability Factors for OSATs

UN SDGs

Amkor Technology

ASE Technology

Growth Opportunity 1: Validation and Verification for HI

Growth Opportunity 1: Validation and Verification for HI (continued)

Growth Opportunity 2: Industry 4.0 for Improving Margins and Efficiency

Growth Opportunity 2: Industry 4.0 for Improving Margins and Efficiency (continued)

Growth Opportunity 3: Strategic Upstream and Downstream Efforts

Growth Opportunity 3: Strategic Upstream and Downstream Efforts (continued)

Growth Opportunity 4: 3D Printing in Semiconductor Packaging

Growth Opportunity 4: 3D Printing in Semiconductor Packaging (continued)

Growth Opportunity 5: Digital Transformation for Efficiently Tackling Shocks

Growth Opportunity 5: Digital Transformation for Efficiently Tackling Shocks (continued)

Growth Opportunity 6: M&As

Growth Opportunity 6: M&As (continued)

Your Next Steps

Why Frost, Why Now?

List of Exhibits

List of Exhibits (continued)

List of Exhibits (continued)

Legal Disclaimer

This study analyzes the global outsourced semiconductor assembly and test (OSAT) market, which is set to experience substantial growth driven by the increasing adoption of advanced packaging technology across various industries. OSATs are third-party providers that specialize in assembly, testing, and packaging (ATP) services and cater to integrated device manufacturers (IDMs), foundries, and fabless chip manufacturers. They offer expertise in both advanced and conventional packaging and testing, benefiting from economies of scale due to their high-volume manufacturing capabilities. By outsourcing backend manufacturing processes to OSATs, chip manufacturers can focus on their core competencies and experience faster turnaround times and reduced time-to-market. This study focuses on pure-play OSATs and foundries offering packaging and testing services, excluding IDMs with in-house packaging capabilities. The research delves into market estimates and forecasts based on the revenue generated by OSATs and foundries through ATP services. The study analyzes end-user industries in detail, outlining the potential OSATs hold for enabling transformative trends like electric mobility, 5G deployments, and the Internet of Things (IoT) through advanced packaging technologies. Additionally, it examines the impact of industry consolidation and geopolitical factors on the OSAT market. The primary goal of this study is to identify growth opportunities emerging from this space and assess factors that may accelerate or hinder market growth. It examines market segments based on end-user industries, packaging technology, interconnect type, and geography. The research includes findings from discussions with industry experts and stakeholders in the OSAT ecosystem, complemented by secondary research, to estimate market size and forecast growth up to 2027. Some of the key study highlights include insights into demand patterns across different regions and a comprehensive analysis of each end-user sector's OSAT opportunities. Additionally, the study examines the capital expenditure trend, the distribution of OSAT facilities, and the value chain of OSAT. The report also contains a competitive analysis, providing market shares for major players. Author: Navdeep Saboo
More Information
Deliverable Type Market Research
Author Navdeep Saboo
Industries Electronics and Sensors
No Index No
Is Prebook No
Keyword 1 Outsourced Semiconductor Assembly and Test
Keyword 2 Outsourced Semiconductor Solutions
Keyword 3 Trends in Outsourced Semiconductor Industry
Podcast No
WIP Number K901-01-00-00-00