Search results for: 'pacif on packaged'

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics. Some of the innovations profiled include Chips on Panel on Substrate Advanced Chip Packaging for Next-Gen AI Systems, Room-Temperature Printable Ink for Adaptive Electronics, GaN for Ultra-Fast 6G...

Food packaging is a relatively new domain. Only a few decades ago, the most commonly used packaging material was brown paper. Even about 60 years ago, butter, bacon, and biscuits were sold without packaging. Grocers weighed the quantities customers wanted and wrapped the food well enough for it to be transported home safely. Motor and industrial oi...

The plastic packaging industry is trying to increase the quality of secondary materials and introduce post consumer recycled content in new packaging to reduce plastic waste. Extended producer responsibility policies among fast-moving consumer goods companies, rising consumer awareness, and sustainability goals such as the European Union target of ...

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...

20 Jul 2022  |  Asia Pacific  |  Market Research

Asia-Pacific Fixed Broadband Growth Opportunities

Transformative Mega Trends Drive the Growth of Fixed Broadband in Asia-Pacific

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Remote working and online learning have transformed the fixed broadband market in Asia-Pacific. These market trends drove up usage of high-data- and high-bandwidth-intensive applications, such as telecommuting, video conferencing and streaming, which increased the demand for high-speed and reliable internet connectivity. However, the growing adopti...

This edition of the Industrial Bioprocessing TOE features information on innovations in carbon removal and sequestration, direct air capture, wood valorization, high-performance bioplastics, bio-based crop protection, sustainable packaging, and sustainable protein production, among others.The Industrial Bioprocessing TOE provides intelligence on te...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

This edition of the Advanced Coating & Surface Technology Opportunity Engine profiles significant advances in advanced coatings and surface treatments for various industrial applications. The featured innovations include Polyurethane-based Lamination System to Improve Packaging Sustainability, Advanced Intumescent Fire Protection Coatings with Pass...

This analysis assesses the power and energy market in Asia-Pacific. The primary focus is power generation, but grids, energy storage, hydrogen, and the role of fossils are included in the trends section. Asia-Pacific encompasses diverse countries, from highly developed economies, such as South Korea and Japan, to under-developed ones such as Lao...