Search results for: 'processing and packaging'

This study provides an analysis of the packaging machinery market in Europe. Despite being affected by the economic recession, the market has rebounded. This indicates growth opportunities over the forecast period. This study covers the drivers and restraints of the market and divides it into FCFC, FFS, grouping, wrapping, palletizing, and other pa...

Traditionally, business process management (BPM) or business process outsourcing (BPO) services were implemented as a cost-optimization concept based on labor arbitrage. However, BPM services have evolved and encompass core and noncore operations. Today, they permeate the entire business process value chain and address a wide variety of business ob...

Dumping of plastics in landfills and in marine environment are having adverse effects across the globe. Also, microplastics found in most of the water sources, affects both human and marine life. The current widely adopted crude-based plastics are degraded to reduce its adverse impact. However, degradation of plastics also requires energy intensive...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Processors, Packaging, Transceivers, Wireless Connectivity and Thermal Management.The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attribut...

08 Feb 2016  |  North America  |  Market Research

Global Process and Production Chemicals for Electronics, Forecast to 2021

Extreme Ultraviolet Lithography and Smaller Nodes to Drive Growth in Materials

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This research service identifies the major industry drivers, restraints, regulatory trends, and technology trends affecting the global market for process and production chemicals for electronics. The product segments covered in this research are semiconductor materials and PCB chemicals. Semiconductor materials market is subdivided into fabrication...

Food packaging is a relatively new domain. Only a few decades ago, the most commonly used packaging material was brown paper. Even about 60 years ago, butter, bacon, and biscuits were sold without packaging. Grocers weighed the quantities customers wanted and wrapped the food well enough for it to be transported home safely. Motor and industrial oi...

The metals and manufacturing sector across the Middle East is undergoing a fundamental structural shift, driven by the convergence of decarbonization mandates, energy transition demand, industrial localization policies, and digital transformation imperatives. This study examines the evolving competitive landscape and identifies ten high-priority gr...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics. Some of the innovations profiled include Chips on Panel on Substrate Advanced Chip Packaging for Next-Gen AI Systems, Room-Temperature Printable Ink for Adaptive Electronics, GaN for Ultra-Fast 6G...

This edition of the Industrial Bioprocessing TOE features information on innovations in carbon removal and sequestration, direct air capture, wood valorization, high-performance bioplastics, bio-based crop protection, sustainable packaging, and sustainable protein production, among others.The Industrial Bioprocessing TOE provides intelligence on te...