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The Microelectronics Technology Opportunity Engine covers innovations pertaining to Silicon Photonics, GaN, Radar and Neuromorphic Edge AI.The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power and cost, s...

02 Jul 2021  |  Global  |  Market Research

The Global Semiconductor Chip Shortage Crisis and Its Effects on the Automotive Industry

About 1.38 Million Fewer Units Were Produced in Q1 2021 Due to Shutdowns and Production Slowdowns Arising from the Chip Shortage. The Situation Could Worsen, and Production is Likely to Reduce by a Further 2.40 Million Units in Q2 2021

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The rising trend of the electrification of vehicles has increased automakers dependency on semiconductor chips, making them a critical component in new-gen cars. Toward the end of 2020, the global shortage of semiconductor chips forced many OEMs to temporarily suspend vehicle production or reduce the working shifts in their factories. Leading OEMs ...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Sub-1 Nm Chip technology, MMIC, SOC, Photonic Chiplet, GaN and Power Electronics among others.The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electron...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Edge AI, AI accelerators, NFC, and 3D Photonic chips among others. The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power...

This issue of the Nanotechnology Opportunity Engine highlights technology developments related to innovations in nanomaterials for healthcare, semiconductors, and consumer goods. Innovations related to conductive nanoinks, nanomanufacturing, nano-titanium dioxide, nanoencapsulation, nanocatalysts, single walled nanotubes, and nanoparticle-assisted ...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

The objective of this growth insight is to identify the key growth opportunities for NDT service providers and NDT equipment suppliers in China, South Korea, and Japan. To achieve this objective, the growth insight starts with discussing the key Mega Trends that are affecting end-user industries as well as the key market trends and technology trend...