The flexible electronics (FE) industry is witnessing enthusiastic participation from various stakeholders who are introducing diverse enabling technologies which in turn are propelling the growth of FE industry. With the convergence of such enabling technologies, FE is expected to grow into a key technology sector with immense potential. The next-generation semiconductor technology, which is currently in its infancy, is expected to find applications in major industries, such as consumer electronics, healthcare, and photovoltaics. With its potential to be integrated with many industries, manufacturing FE is expected to be the next major job creating technology thus harnessing immense interest from government and legislative bodies.
Key factors that are decreasing the potential for FE are advancement in material sciences and manufacturing processes that are unable to meet cost-performance demand. Constraints in development in this sector are mainly due to lack of standardized tools, an industry-accepted manufacturing technique, integration, and maintenance standards.
Manufacturing techniques for FE need standardization and further capital intensive research initiatives to accelerate the market adoption of FE products. This requires developing a scalable manufacturing process that focuses more on process control which reduces production cost and enables product variability.
Major stakeholders involved in the FE industry are actively encouraged by government bodies, thus making the innovation landscape highly effective. APAC and North America (NA) are witnessing an active innovation scenario focusing on niche areas in the FE industry while the European Union (EU) has a broader focus ranging from manufacturing to differentiated product developments.
This technology report captures manufacturing innovations that enables production of cost-effective flexible electronics products.