Search results for: 'package-on-package'

The proliferation of IoT is driving demand for smart computing devices that offer an array of features and services such as real-time access to information, resources, and communications. To keep pace with these enhancements, devices have become more powerful and more complex, driving the need to integrate multiple systems on a single IC. A SoC int...

26 May 2023  |  Global  |  Market Research

Global Policy Analysis on Semiconductor Localization

Building Self sufficiency in Semiconductor Manufacturing for Competitive Advantage

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Semiconductors are essential blocks of all modern-day electronic devices and enable Mega Trends, such as connected and automated ecosystems across industries. However, supply chain disruptions resulting from the impact of the COVID-19 pandemic, the US-China trade war, and the China-Taiwan conflict are at the center of global semiconductor policies....

The objective of this research service is to identify and understand the key Mega Trends in the mechanical test industry that will impact and shape a country’s economy, society, and culture. Frost & Sullivan’s mechanical test program covers a wide range of industrial inspection and monitoring markets and technologies, including non-destructive test...

The Microelectronics Technology Opportunity Engine provides profiles of innovations related to Novel Ultrathin LPDDR5X DRAM Packages, Compute Express Link (CXL) Memory Module, Low-loss Glass in Semiconductor Manufacturing and Advanced Semiconductor Packaging material.The Microelectronics Technology Opportunity Engine captures global electronics-rel...

This research service focuses on key semiconductor types enabling 5G connectivity in devices and network infrastructure. The key components included are Modem ICs/SoC, RFICs, power amplifiers (PA), filters, low noise amplifiers (LNAs), beamformer ICs, switches, and envelope trackers, among others. End-user applications include smartphones, network ...

This market insight analyzes the various requirements of communication test equipment end users, globally, and provides strategies test vendors can use to achieve higher sales of their equipment. The segments included in this analysis are wireline, wireless, and fiber optics. The results and analysis are based on an end-user survey, weighing their ...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

22 May 2026  |  Global  |  Market Research

Growth Opportunities in the Automated Optical Inspection (AOI) Market, Global, 2025–2030

Zero-Defect Manufacturing is Driving Transformational Growth in the AOI Market

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Automated optical inspection (AOI) ensures quality and yield improvements in electronics manufacturing, printed circuit board (PCB) assembly, and advanced packaging. The trend toward reduced form factors in electronics results in increased component density that requires intelligent inspection. This analysis explores opportunities in the AOI market...

17 Aug 2020  |  North America  |  Market Research

On-demand Manufacturing Propels the Global Dimensional Metrology Equipment Market for Additive Manufacturing

Future Market Prospects Enhanced by Growth Opportunities in Medical and Electronics Additive Manufacturing

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This Frost & Sullivan research service analyzes the global dimensional metrology market for additive manufacturing in detail for the period from 2018 to 2024, with 2019 as the base year. The study covers key advanced technologies, including optical microscopes, scanning electron microscopes, coordinated measuring machines (CMM), 3D scanning, X-ray ...