Search results for: 'Semiconductor end market'

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

12 Jun 2023  |  Global  |  Technology Research

Industry Cloud Platforms: An End-to-end Specialized Solution

Data-driven Insights Boost the Industry Cloud Platform Growth Pipeline

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An industry cloud platform is designed to meet the specific needs of respective industries. It provides sector-specific solutions and services through the cloud, such as data analytics, machine learning, and asset management, to help organizations improve efficiency, reduce costs, and drive innovation. The adoption of industry cloud platforms is...

Tablets are a mobile device category which support advanced computing capabilities on a larger (7"+) screen, but do not have traditional integrated voice functionality. 'Next Generation' tablets run advanced operating system software that provides a standardized platform for application development and 'connected' content consumption. While the ...

This end-user survey shows current adoption statistics of technologies used in multi-channel contact centers. Investment plans in multi-channel contact technologies for the future are also indicated. The results are based on a web-based survey conducted by Frost & Sullivan.

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

This market insight discusses current and future trends, 2009 outlook, and buyer behavior in the contact center market. The research findings are based on a comprehensive end-user survey conducted by Frost & Sullivan. We targeted 332 Contact Center decisions makers, based primarily in North America; specifically, those who manage, support or influe...

Across industries, companies expect to increase their IT and Communications investments by 22Percentage. Almost 100Percentage of businesses in Europe have a digital transformation today; however, 19Percentage believe they are behind others on their journey. This is good news for technology vendors; however, the key to success is to gain a deeper un...

Most of the major factors driving adoption of the Cloud Computing concept by companies in Brazil are the same ones that boost more mature markets such as the USA and Western Europe. Fortunately for the Latin American and Caribbean region, countries such as Brazil, Colombia and Chile were not so effected by the economic crisis as some other economie...