Search results for: '20 packaging'

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Processors, Packaging, Transceivers, Wireless Connectivity and Thermal Management.The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attribut...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics. Some of the innovations profiled include Chips on Panel on Substrate Advanced Chip Packaging for Next-Gen AI Systems, Room-Temperature Printable Ink for Adaptive Electronics, GaN for Ultra-Fast 6G...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

The Microelectronics Technology Opportunity Engine focusses on capturing innovations related to Memristors, Open-Source Processors, Chip Integrated Capacitor, 3D Packaging, Neuromorphic Chip, Hybrid Transistor, Quantum Processor, Cryogenic Memory, Photonic Chip, Ion Based Quantum Chip.The Microelectronics Technology Opportunity Engine captures glob...

Valence Security is a leading SaaS security posture management (SSPM) provider, delivering comprehensive security through its SaaS Security Platform. Valence Security enables organizations to discover, identify, and inventory all SaaS applications, including shadow SaaS such as GenAI applications. Through its SSPM capabilities, it ensures secure co...

This Frost & Sullivan study explores the innovative use of drones in commercial last-mile deliveries in the global logistics industry. Drones for commercial last-mile deliveries have experienced growth following their use during the COVID-19 pandemic, as part of a large-scale effort to encourage contactless deliveries. Drones for this use-case have...

The Microelectronics Technology Opportunity Engine provides profiles of innovations related to Novel Ultrathin LPDDR5X DRAM Packages, Compute Express Link (CXL) Memory Module, Low-loss Glass in Semiconductor Manufacturing and Advanced Semiconductor Packaging material.The Microelectronics Technology Opportunity Engine captures global electronics-rel...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...