Search results for: 'plan on packaged'

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Processors, Packaging, Transceivers, Wireless Connectivity and Thermal Management.The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attribut...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics. Some of the innovations profiled include Chips on Panel on Substrate Advanced Chip Packaging for Next-Gen AI Systems, Room-Temperature Printable Ink for Adaptive Electronics, GaN for Ultra-Fast 6G...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

12 Jun 2020  |  North America  |  Market Research

US Department of Homeland Security Spending Plan to 2024

An Assessment of the COVID-19 Impact on Agency Budgets

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Key Issues Addressed

The 2021 Department of Homeland Security (DHS) budget request was released in February 2020, and revealed a decrease from the 2020 enacted budget. However, the proposed budget remains in line with the current administration’s commitment to: • reinforce the US southern border, • build up cyber security defenses, • harden the US infrastructu...

This research service focuses on the US Department of Defense (DoD) special operations command (SOCOM) budget spending. Included in this service are research, development, testing, and evaluation (RDT&E); procurement; operations and maintenance (O&M); and services. Contract activity for the DoD SOCOM for 2012 is also included. The DoD SOC 2014 Budg...

The Microelectronics Technology Opportunity Engine focusses on capturing innovations related to Memristors, Open-Source Processors, Chip Integrated Capacitor, 3D Packaging, Neuromorphic Chip, Hybrid Transistor, Quantum Processor, Cryogenic Memory, Photonic Chip, Ion Based Quantum Chip.The Microelectronics Technology Opportunity Engine captures glob...

In this 2015 edition, 10 new countries with rapidly evolving defence spending have been selected. This study comprises a thorough market assessment for 2015-2025 of Colombia, Kuwait, Malaysia, Morocco, and Singapore, including projected defence spending by appropriation: procurement (equipment), personnel, operations and maintenance, infrastructure...

In this research service, Frost & Sullivan provides an overview of the Latin American defense market, highlighting growth drivers and restraints, growth opportunities, and notable companies with active contracts or a presence in the region. The study also outlines the most relevant projects and programs as well as representative contracts. Latin A...

This Frost & Sullivan study explores the innovative use of drones in commercial last-mile deliveries in the global logistics industry. Drones for commercial last-mile deliveries have experienced growth following their use during the COVID-19 pandemic, as part of a large-scale effort to encourage contactless deliveries. Drones for this use-case have...