Search results for: 'electron active material'

This research study examines the global electronic commerce (eCommerce) market with a focus on North America and the information technology (IT) and consumer electronics verticals. The report delves into the macro-economic factors affecting the global retail eCommerce market, its growth during the course of the COVID-19 pandemic, as well as the dri...

The impact of the COVID-19 pandemic continues to reverberate in the Internet of Things (IoT) space. This Frost & Sullivan reforecast of the cellular IoT connections market indicates that there will be more than 3.46 billion active cellular IoT connections by 2026 (globally). In 2020, growth declined to 13.5%, with Asia-Pacific accounting for a larg...

This study is an updated IoT Device forecast with 2020 as the base year. The forecast accounts for the impact of the COVID-19 pandemic on the adoption and implementation of IoT devices in 2021 and beyond. The study is a detailed forecast of the total number of IoT devices globally. The study is broken out by region: North America, Asia-Pacific, Eur...

Cellular IoT connectivity is a booming market. It is witnessing rapid growth as 2G and 3G connections are being replaced with 4G-LTE, 5G, and low-power connections. Typically, 4G-LTE and 5G connections are the major revenue generators for cellular network operators. In 2020, global connectivity revenue stood at $47.02 billion. Asia-Pacific accounte...

The Internet of Things (IoT) extends Internet connectivity beyond traditional devices such as desktop and laptop computers, smartphones, and tablets, to other devices that use embedded technology to communicate and interact over the Internet. IoT means that everyday physical objects, from vehicles to manufacturing equipment to hotel coffee makers a...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...

The consumer eSIM market in Western Europe is growing steadily, supported by the rising availability of eSIM-capable devices, particularly smartphones, and expanding travel-related use cases. However, commercialization has yet to translate into mass adoption. Despite Apple’s global launch of an eSIM-only smartphone in September 2025, which prompted...

This study covers the reaction of traditional insurance companies, the Malaysian government and supporting organisations to the new-generation trend of InsurTech and explores InsurTech start-ups active in the Malaysian market. The Malaysian insurance industry has been showing good growth since its inception as Bank Negara Malaysia (BNM; the centra...