Search results for: 'engineering service'

The Microelectronics Technology Opportunity Engine provides profiles of innovations related to High-qubit Quantum Computing Platform, Energy-efficient and Scalable AI Accelerators, High-performance and Scalable Quantum Computers, Sustainable Tensor Processing Technology, High Performance eFPGA and Advanced Optical DSP.The Microelectronics Technolog...

The Microelectronics Technology Opportunity Engine provides profiles of innovations related to Programmable USB Peripheral Controller, 40G UCIe IP Solution for High-performance Multi-die Designs, Smart Bluetooth Low Energy (BLE) Universal Serial Bus (USB) Dongle and Durable Ferroelectric Transistors.The Microelectronics Technology Opportunity Engin...

The Microelectronics Technology Opportunity Engine provides profiles of innovations related to High-qubit Quantum Computing Platform, Energy-efficient and Scalable AI Accelerators, High-performance and Scalable Quantum Computers, Sustainable Tensor Processing Technology, Modular Quantum Computing Architecture, Turnkey High-performance Quantum Compu...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to memory systems such as DRAM, MRAM, and other memory technologies for improved performance, advancements in materials enabling next generation chipsets, 3.5D System-in-Package Platform For Enhanced AI Training, GaN Device for Improved Motor Energy Efficiency and Low-...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to graphics cards, ultra-high speed memory test systems, RISC-V technology advanced brain chip, advanced front-end Beamforming IC for enhanced 5G communication, 5G Antenna, AI accelerators, and high efficiency power electronics.The Microelectronics Technology Opportuni...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to optoelectronics powering Hyperscale AI and Data Center Interconnects, Advanced Transceiver Chip For Increased Communication Efficiency, Low-Power System-on-Module (SoM) For Enhanced AI Applications, Next-generation Defect Review System with Faster Analysis of Nanosc...

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...

The escalating compute and power demands of edge AI are exposing the limits of conventional von Neumann architectures. Manufacturers deploying always-on sensing, real-time inference, and autonomous decision-making at the edge are constrained by the energy, latency, and memory-bandwidth ceilings of standard NPUs and MCUs. Traditionally, edge AI work...

The era of robotics is becoming a disruptive force in the food and beverage (F&B) industry, most notably in production, services, and delivery. By leveraging advanced AI, sensing technologies, and adaptive automation, robotic technologies are delivering groundbreaking advancements in operational precision, performance, and reliability. This transfo...