The Microelectronics Technology Opportunity Engine covers innovations pertaining to optoelectronics powering Hyperscale AI and Data Center Interconnects, Advanced Transceiver Chip For Increased Communication Efficiency, Low-Power System-on-Module (SoM) For Enhanced AI Applications, Next-generation Defect Review System with Faster Analysis of Nanoscale Defects, RISC-V architecture, advancement in Flexible Hybrid Electronics Manufacturing, SiC MOSFET technology and glass based photonic chips for quantum computing.

The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Keywords: Optoelectronics, AI, Data center, chiplets, SoC, SoM, RISC-V, flexible hybrid electronics, SiC, MOSFET, Edge AI, photonic chip, augmented reality, OLED display