Search results for: 'Grid Interconnection study'

In this study, Frost & Sullivan analyzes the mobility innovation ecosystem by examining automotive and mobility-related patents across the connected, autonomous, shared, and electric (CASE) mobility dimensions.Some relevant details are as follows. • The scope covers North America, with a primary focus on the United States, due to the dep...

This study seeks to evaluate the current usage of the in-car marketplace and features on demand (FoD) services such as navigation and location-based features, integration and productivity, driving convenience solutions, remote services and maintenance, in-car personalization, entertainment, and performance and driving services in the United States....

The Mobility Technology Opportunity Engine (TOE) provides profiles of innovations related to Fun Utility Vehicle (FUV) Revolutionizing Urban Mobility with Efficient, Sustainable, Electric 3-Wheeled Design, High-definition (HD) Map Cloud Technology, Autonomous Vehicle Technology, Vehicle-to-grid (V2G) Technology and Hybrid-electric Aircraft System.T...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...

This study focuses on heterogeneous computing architectures for automotive and robotics applications, examining how centralized and zonal compute architectures, heterogeneous SoCs integrating CPUs, GPUs, NPUs, DSPs, FPGAs, and dedicated safety islands, as well as robotics edge-AI controllers and mixed-criticality computing platforms, are enabling t...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

Chiplet-based compute architectures for vehicles are entering a new phase, reshaping SDV hardware roadmaps by enabling modular multi-die platforms that scale performance, improve yield, and accelerate refresh cycles while meeting long lifecycles, safety, and cybersecurity requirements. This Frost & Sullivan study examines how automakers, Tier 1s, s...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

The European ridehailing market is rapidly evolving, shaped by technological advancements, changing consumer preferences, and regulatory dynamics. While Uber and Bolt are the formidable players, local and regional competitors such as FreeNow, Cabify, inDrive, Yango Ride, and Heetch each have their own strengths and specific regions of operation, co...