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Despite disrupting sales and profitability in many markets, the pandemic has ignited minds to build a safer and convenient environment. The connected automotive industry is making the best of the situation through trending use cases that build the new normal across consumer segments. Adapting to the new form of travel, Frost and Sullivan's ‘Voice o...

The COVID-19 pandemic has placed a greater emphasis on a safe environment and exacerbated the need for more convenience in daily activities. The automotive industry has aligned itself with this trend, focusing on solutions and systems that enhance the safety and comfort of drivers and passengers. This study aims to support automakers and allied ind...

Despite disrupting sales and profitability in many markets, the pandemic has ignited minds to build a safer and convenient environment. The connected automotive industry is making the best of the situation through trending use cases that build the new normal across consumer segments. Adapting to the new form of travel, Frost and Sullivan's 'Cars as...

The Mobility Technology Opportunity Engine (TOE) covers innovations pertaining to AI Powered Autonomous Driving, SDV, Charging, Chip Architecture, and ADAS.The purpose of the Mobility Technology TOE is to raise awareness of global technology innovations in self-propelled ground-based mobile platforms that are not only technically significant but p...

The robotaxi industry has moved from research and testing into early-stage commercial operations. A small number of companies are now generating revenue from fully autonomous, driverless ride-hailing services operating on public roads. Organizations that understand how the competitive landscape is forming today will be better positioned to make dec...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

Hybrid vision systems (HVS) are positioned to substantially impact perception-driven applications across a diverse array of sectors, including robotics, manufacturing, logistics, mobility, surveillance, and agriculture. By intricately combining the geographical precision of LiDAR with the semantic intelligence of advanced imaging systems, these inn...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...