Search results for: 'rigid plastic packaging'

This issue of High-Tech Materials Technology Opportunity Engine (TOE) profiles significant advancements in high-tech materials for various enhanced industrial applications. The featured innovations include Recycling Polystyrene to Produce Sustainable Surface Materials, Seaweed-based Sustainable and Biodegradable Packaging, High-performance Plant-ba...

10 Jul 2019  |  Global  |  Market Research

Future of Circular Economy in the Plastic Packaging Recycling Market, Forecast to 2030

Sustainability Goals, Stringent Regulation, Industry Collaboration, Disruptive Technologies, and Digital Transformation to Drive Recycling and Resource Recovery Efficiency

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Key Issues Addressed

Innovative business models such as deposit return schemes, disruptive applications like augmented reality (AR), composite plastic separation, plastic to fuel etc., will drive the circular economy in the plastic packaging recycling market in the future. The market revenue is estimated at $13.1 billion and is expected to have a CAGR of 9.1% during th...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Processors, Packaging, Transceivers, Wireless Connectivity and Thermal Management.The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attribut...

18 May 2023  |  Global  |  Market Research

Global Medical Plastics Market Growth Opportunities

Increasing Healthcare Expenditure Enhances Future Growth Potential in Developing Economies

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Medical plastics are largely used across the healthcare sector for manufacturing diagnostic and therapeutic medical devices, equipment, surgical/non-surgical instruments, labware, prosthetics, implants, and healthcare packaging products. These offer various advantages over conventional materials such as metals, paper, and glass, including light wei...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics. Some of the innovations profiled include Chips on Panel on Substrate Advanced Chip Packaging for Next-Gen AI Systems, Room-Temperature Printable Ink for Adaptive Electronics, GaN for Ultra-Fast 6G...

This edition of the Advanced Coating & Surface Technology Opportunity Engine profiles significant advancements in high-tech materials for various enhanced industrial applications. The featured innovations include Roll-to-Roll System for Ultra-thin Lithium Film Deposition in Battery Manufacturing, Humidity-responsive UV Protection Film for Adaptive ...

This edition of the Advanced Coating & Surface Technology Opportunity Engine profiles significant advances in advanced coatings and surface treatments for various industrial applications. The featured innovations include Polyurethane-based Lamination System to Improve Packaging Sustainability, Advanced Intumescent Fire Protection Coatings with Pass...

This Frost & Sullivan analysis assesses the growth opportunities across the food processing and packaging equipment market. The application areas considered include beverages; fruits and vegetables; dairy; meat, fish, and poultry; bakery and confectionary; oils and fats; breakfast cereals, and snacks; and pet food. The equipment scope includes all ...

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...