Search results for: 'ride plastic packaging market'

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics. Some of the innovations profiled include Chips on Panel on Substrate Advanced Chip Packaging for Next-Gen AI Systems, Room-Temperature Printable Ink for Adaptive Electronics, GaN for Ultra-Fast 6G...

Rigid plastics are well suited for packaging: they are lightweight, break- and shatter-proof, and easy on the pocket. They are used to make caps, closures, cups, and bottles, and other packaging items. Increasing demand from end-use industries such food and beverage and pharmaceuticals, consumer preferences for convenience, and new product and tech...

29 Sep 2020  |  Global  |  Frost Radar

Frost Radar™: Global Flexible Plastic Packaging Market, 2020

A Benchmarking System to Spark Companies to Action - Innovation that Fuels New Deal Flow and Growth Pipelines

Infographics

×

Flexible plastics have been a part of the packaging industry since the invention of cellophane more than 100 years ago. Light weight, low manufacturing cost, easy storage, and intrinsic properties such as chemical and moisture resistance are among the valuable features. Sustainability has become an important consideration in the packaging industry...

11 Dec 2018  |  Global  |  Market Research

Analysis of Global Rigid Plastic Packaging Market, Forecast to 2022

Changing Consumer Preferences and Rise in per Capita Income Drive the Demand

Infographics

×

A rigid plastic material is defined as a material that exhibits no elastic deformation and perfect plastic deformation. Thus, the rigid plastics cannot be easily squeezed and are generally self-supporting and free-standing. Rigid plastics are well suited for packaging as these are lightweight, break- and shatter-proof, and easy on pocket. Rigid pla...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

This study provides an analysis of the packaging machinery market in Europe. Despite being affected by the economic recession, the market has rebounded. This indicates growth opportunities over the forecast period. This study covers the drivers and restraints of the market and divides it into FCFC, FFS, grouping, wrapping, palletizing, and other pa...

This issue of High-Tech Materials Technology Opportunity Engine (TOE) profiles significant advancements in high-tech materials for various enhanced industrial applications. The featured innovations include Recycling Polystyrene to Produce Sustainable Surface Materials, Seaweed-based Sustainable and Biodegradable Packaging, High-performance Plant-ba...

10 Jul 2019  |  Global  |  Market Research

Future of Circular Economy in the Plastic Packaging Recycling Market, Forecast to 2030

Sustainability Goals, Stringent Regulation, Industry Collaboration, Disruptive Technologies, and Digital Transformation to Drive Recycling and Resource Recovery Efficiency

Infographics

×

Key Issues Addressed

Innovative business models such as deposit return schemes, disruptive applications like augmented reality (AR), composite plastic separation, plastic to fuel etc., will drive the circular economy in the plastic packaging recycling market in the future. The market revenue is estimated at $13.1 billion and is expected to have a CAGR of 9.1% during th...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Processors, Packaging, Transceivers, Wireless Connectivity and Thermal Management.The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attribut...