Search results for: 'osats 2014'

Growth forecasts in 2013 were constantly upgraded or downgraded due to the long-lasting effects of debt in Europe, and stronger performances from the United States and the United Kingdom. Emerging global economies were also beginning to feel the effects of the easing of the US monetary policy; this led to volatility in capital markets globally. For...

The research service sets the stage for visionary thinking by identifying and analyzing various Mega Trends that will impact and shape the global economy, society, and culture. For the purpose of this study, Mega Trends are categorized by urbanization, society, economy, technology, infrastructure, business, health and wellness, and top industries. ...

Smart card vendors continue to move from provisioning of physical cards to the delivery of smart card-related software and services. The commoditization of physical smart cards and the progressive digitalization of services have forced smart card vendors to re-think their strategies and focus on the services side of their business. Frost & Sullivan...

13 Oct 2023  |  Global  |  Market Research

Global Outsourced Semiconductor Assembly and Test Growth Opportunities

Increasing Adoption of Advanced Packaging and the Need for Cost-effective ATP Solutions will Fuel Transformational Growth

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This study analyzes the global outsourced semiconductor assembly and test (OSAT) market, which is set to experience substantial growth driven by the increasing adoption of advanced packaging technology across various industries. OSATs are third-party providers that specialize in assembly, testing, and packaging (ATP) services and cater to integrate...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...

This study focuses on heterogeneous computing architectures for automotive and robotics applications, examining how centralized and zonal compute architectures, heterogeneous SoCs integrating CPUs, GPUs, NPUs, DSPs, FPGAs, and dedicated safety islands, as well as robotics edge-AI controllers and mixed-criticality computing platforms, are enabling t...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

Chiplet-based compute architectures for vehicles are entering a new phase, reshaping SDV hardware roadmaps by enabling modular multi-die platforms that scale performance, improve yield, and accelerate refresh cycles while meeting long lifecycles, safety, and cybersecurity requirements. This Frost & Sullivan study examines how automakers, Tier 1s, s...

The global semiconductor automated test equipment (ATE) market is witnessing a decline due to the global economic downturn and volatility in demand from the semiconductor market. Trade tensions in major semiconductor hubs – China, South Korea, Japan and the United States – are deterring semiconductor manufacturers and vendors from making any major ...