Innovations in Materials for Flexible Electronics (TechVision)

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Flexible electronics are highly popular owing to their high usage convenience, novel display attributes, high reliability, and lightweight. These devices find high potential for adoption in a range of high-end application sectors, which includes consumer electronics, automotive, healthcare, energy, defense, and textiles. However, flexible electronics need to address several key challenges in their performance before they can satisfy high mass volume demand. Flexible substrate materials used for the development of flex circuits have been identified as key enabling components that determine the performance of flexible electronics. Flexible substrate materials that provide high device efficiency, optimal product

Table of Contents

1.0 Executive Summary1.1 Research Scope1.2 Research Process and Methodology1.3 Key Findings: Low-cost and Highly Optically Transparent Substrates Will Lead Adoption in Future2.0 Technology Snapshot2.1 Flexible Electronics – An Overview: An Emerging Product Concept Designed to Meet Consumer Demand for Novel Properties in Devices2.2 Flexible Electronics – Application Segmentation: High Promise in the Consumer Electronics Sector 2.3 Flexible Substrates–Technology Snapshot: Enabling Technologies that Determine the Performance of Flexible Electronics2.4 End User Requirements for Flexible Substrate Materials: Need for Stable Substrates that Facilitate High Performance of Devices 2.5 Currently Used Substrate Materials: Polymer Substrates Are Widely Adopted Followed by Metal Substrates3.0 Materials Used for Flexible Electronic Substrates3.1 Glass Substrates – Technology Snapshot: Highly Stable but Unsuitable for Mass Processing3.2 Glass Substrates – Key Innovations: Large Volume Production of Ultrathin Glass 3.3 Metal Substrates–Technology Snapshot: High Impermeability and Lightweight Attributes3.4 Metal Substrates – Key Innovations: Developments Include Flexible Solar Cells and OLEDs3.5 Polymer Substrates – Technology Snapshot: Low Cost and Variations in Performance Properties3.6 Overview of Polymer Substrates: PET and PEN Are the Most Widely Used Polymer Materials3.7 Overview of Polymer Substrates: PI is Showing Promise in Adoption for Flexible Substrates3.8 Overview of Polymer Substrates: PC Films Are Used in High Durability Applications3.9 Polymer Substrates – Key Innovations: Applications Focused on Organic Electronics3.10 End-user Gap Analysis: Unmet End-user Requirements Creates Demand for Novel Substrate Materials 3.11 Emerging Substrate Materials: Biocompatible and Stretchable Substrate Materials Are Being Developed3.12 Emerging Materials – Key Innovations: Low-cost Substrate Materials with High Optical Performance4.0 Industry Overview4.1 Technology Drivers: Superior Printability and Lightweight Properties Drive Adoption 4.2 Technology Restraints: High Competition from Rigid Substrates and Lack of Materials That Provide Long Operation Lifetime Hinders Adoption4.3 Technology Value Chain: Highly Integrated Industry with Increasing Contribution from Coating Developers 4.4 Key Technology Stakeholders: Technology Developers Are Spread across North America, Europe, and Asia-Pacific4.5 Recent R&D Initiatives: Government Funding Contributes Significantly to Technology Development 5.0 Technology Development and IP Trends5.1 Global Technology Development Potential: North America Leads in Technology Development5.2 Global Technology Adoption Potential: Mass Volume Production Methods Facilitate High Adoption in North America5.3 Patent Trends – Country-wise Charts: US Leads Number of Granted Patents 5.4 Patent Trends – Historical Charts for All Substrate Materials: Main Focus Among Granted Patents Is on Polymer Substrates5.5 Patent Trends – Historical Charts for Polymer Substrate Materials: Highest Innovations on PET Substrates, Followed by PI6.0 Technology Benchmarking of Materials for Flexible Electronics6.1 Opportunity Strategy Evaluation (OSE) of Flexible Substrate Materials6.2 Insights from the OSE Grid: Increasing Opportunities for Material Developers 7.0 Technology Roadmap7.1 Technology Roadmap – Assessment of Future Trends: Technology Development Scenario 2016–2020 7.2 Technology Roadmap – Explanation: High Performance PI Substrates and Biocompatible Substrates Are Key Innovations Expected in 20208.0 Key Patents8.1 Key Patents – USPTO 8.2 Key Patents – EPO 8.3 Key Patents – WIPO 9.0 Key Contacts9.1 Key Contacts10.0 Appendix10.1 Appendix A – OSE Grid: Definition of Criteria Used for Evaluation10.2 Appendix A – OSE Grid: Explanation of Quadrant Placement in the Matrix10.3 Appendix A – OSE Grid: Criteria-based Evaluation of Currently Used Substrate Materials10.4 Appendix A – OSE Grid: Criteria-based Evaluation of Emerging Substrate MaterialsLegal Disclaimer11.0 The Frost & Sullivan Story11.1 The Frost & Sullivan Story11.2 Value Proposition: Future of Your Company and Career11.3 Global Perspective11.4 Industry Convergence11.5 360º Research Perspective11.6 Implementation Excellence11.7 Our Blue Ocean Strategy

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