Search results for: '2020 packaging'

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Processors, Packaging, Transceivers, Wireless Connectivity and Thermal Management.The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attribut...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics. Some of the innovations profiled include Chips on Panel on Substrate Advanced Chip Packaging for Next-Gen AI Systems, Room-Temperature Printable Ink for Adaptive Electronics, GaN for Ultra-Fast 6G...

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

13 Oct 2023  |  Global  |  Market Research

Global Outsourced Semiconductor Assembly and Test Growth Opportunities

Increasing Adoption of Advanced Packaging and the Need for Cost-effective ATP Solutions will Fuel Transformational Growth

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This study analyzes the global outsourced semiconductor assembly and test (OSAT) market, which is set to experience substantial growth driven by the increasing adoption of advanced packaging technology across various industries. OSATs are third-party providers that specialize in assembly, testing, and packaging (ATP) services and cater to integrate...

The Microelectronics Technology Opportunity Engine focusses on capturing innovations related to Memristors, Open-Source Processors, Chip Integrated Capacitor, 3D Packaging, Neuromorphic Chip, Hybrid Transistor, Quantum Processor, Cryogenic Memory, Photonic Chip, Ion Based Quantum Chip.The Microelectronics Technology Opportunity Engine captures glob...

3D Integrated Circuit technology enables the development of high performing microchips with small form factor and low-power consumption capability. With the growing demand for miniaturization in industries like consumer electronics and information and communication technology, 3D ICs are actively being considered as the ideal solution. The key requ...

The retail industry is the largest end user of RFID products and solutions. Mandates from large retailers, such as Walmart, Macy’s, Gerry Weber, and Metro have also boosted adoption of RFID in the retail industry. Retailers achieve end-to-end visibility and business efficiency by implementing item-level tagging. In addition, retailers are likely to...

03 Jul 2020  |  Global  |  Frost Radar

Frost Radar™: Global RFID Printer Market, 2020

Benchmarking Future Growth Potential

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Recent plant automation trends have boosted the demand for RFID in the manufacturing sector, particularly in automotive and aerospace manufacturing which focuses on process efficiency. Loss/theft of assets, misplaced tools, and uncoordinated inventory management disrupt production in a plant and cause monetary losses. RFID helps track assets, tools...