Search results for: 'software-as-a-service'

The Microelectronics Technology Opportunity Engine provides profiles of innovations related to high-performance FPGA-based system-on-module (SoM), mobile processors for consumers, MPS-based SiC diodes for industrial applications, FPGA for Edge applications, and enhanced AI processors for IoT applications.The Microelectronics Technology Opportunity ...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to High-Efficiency Power Module for Reliable AI at the Edge Performance, Programmable USB Peripheral Controller to Create USB Devices, Compact AI Supercomputer Platform, Ultra-Wide Band Transceiver, Advanced TPU AI Inference Chip, and Space-based 5G Connection.The Micr...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to graphics cards, ultra-high speed memory test systems, RISC-V technology advanced brain chip, advanced front-end Beamforming IC for enhanced 5G communication, 5G Antenna, AI accelerators, and high efficiency power electronics.The Microelectronics Technology Opportuni...

LiDAR technology has dramatically transformed in the last decade, creating significant demand for small, affordable, reliable, and sustainable LiDAR sensors. The need for efficiency, accuracy, depth mapping, low-light imaging, and videography in automotive, industrial, infrastructure, and consumer electronics products has driven LiDAR adoption acro...

25 Mar 2025  |  Global  |  Technology Research

Top 10 Sensing Technologies in the Automotive Industry

Camera Sensors and Position Sensors Will Significantly Impact the Automotive Industry

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The automotive market is growing rapidly with fast-paced innovations and consumer demand. With an increased focus on comfort, convenience, safety, vehicle emissions, and other global standards, the global automotive sensors market too is experiencing an exponential growthSeveral countries have set up regulations and standards to be met before a veh...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics. Some of the innovations profiled include Chips on Panel on Substrate Advanced Chip Packaging for Next-Gen AI Systems, Room-Temperature Printable Ink for Adaptive Electronics, GaN for Ultra-Fast 6G...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to SRAM, Multi-chip Architecture, LoRa and AI Accelerators. Some of the innovations profiled include 2nm Custom SRAM for AI & Cloud Infrastructure Applications, Modular Quantum System with Reduced Gate Error and Multi-Chip Architecture, Microcontroller Series with High...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to optoelectronics powering Hyperscale AI and Data Center Interconnects, Advanced Transceiver Chip For Increased Communication Efficiency, Low-Power System-on-Module (SoM) For Enhanced AI Applications, Next-generation Defect Review System with Faster Analysis of Nanosc...

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...