Search results for: 'organization future pic reporting workforce'

Photonic integrated circuit (PIC) is an optical chip which accommodates multiple photonic functions and is being developed as an alternative for electronic integrated circuits. Their capability to transmit data in optical medium unlike electronic ICs make them effective medium for communication in telecom and datacentre sectors. In case of sensors,...

Future of Retail 4.0 marks a pivotal shift in the retail landscape, driven by intelligent systems, automation, and ethical consumerism. Businesses are rapidly adopting models like Retail as a Service and Real-Time AI Pricing to enhance operational efficiency and dynamic market responsiveness. IoT-powered smart store infrastructure and AI-driven los...

This study examines the technology landscape, commercialization progress, and future growth opportunities of wide-bandgap (WBG) semiconductor materials, with a primary focus on silicon carbide (SiC), gallium nitride (GaN), and gallium oxide (Ga₂O₃) for power and RF electronics. It evaluates how these materials enable higher efficiency, greater powe...

With the growing market for electronics and increasing complexities of the appliances it is necessary to build the skilled workforce. Majority of the servicing of consumer appliances is done mostly by the unorganized segment creating the need to move them to organized arena. Manpower deficit, outdated curriculum coupled with high attrition and lack...

Smart appliances are appliances connected to the Internet or to the Bluetooth and are controlled or monitored through remote commands using a smartphone, tablet, or any other device. With more than 500 million smartphone users in India, mobile connectivity and availability of easy-to-install applications are drivers for the growth of smart applianc...

Transistors are the fundamental electronic components present in any device. They have evolved over a period of 30 years in size and performance. Their capability to act as a switch or amplify current or voltage has enabled them to serve diverse applications ranging from logic gates in the computer processors to sound amplifiers. Research and devel...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

Hybrid vision systems (HVS) are positioned to substantially impact perception-driven applications across a diverse array of sectors, including robotics, manufacturing, logistics, mobility, surveillance, and agriculture. By intricately combining the geographical precision of LiDAR with the semantic intelligence of advanced imaging systems, these inn...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to AI Processors, Silicon Photonics, SoCs and Chiplets among others.The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power a...