Search results for: 'package-on-package'

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Processors, Packaging, Transceivers, Wireless Connectivity and Thermal Management.The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attribut...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics. Some of the innovations profiled include Chips on Panel on Substrate Advanced Chip Packaging for Next-Gen AI Systems, Room-Temperature Printable Ink for Adaptive Electronics, GaN for Ultra-Fast 6G...

3D ICs are redefining semiconductor innovation by enabling significant gains in performance, density, and energy efficiency. This report provides an executive view of how advances in vertical stacking, heterogeneous integration, chiplet-based design, and advanced packaging are reshaping design and manufacturing strategies across the industry. It hi...

This study focuses on how next-generation chiplet architectures, high-bandwidth memory (HBM), and advanced packaging technologies such as 2.5D/3D integration and fan-out wafer-level packaging are enabling the next wave of AI and high-performance computing (HPC) system architectures, rather than providing a broad packaging market overview. It analyz...

13 Oct 2023  |  Global  |  Market Research

Global Outsourced Semiconductor Assembly and Test Growth Opportunities

Increasing Adoption of Advanced Packaging and the Need for Cost-effective ATP Solutions will Fuel Transformational Growth

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This study analyzes the global outsourced semiconductor assembly and test (OSAT) market, which is set to experience substantial growth driven by the increasing adoption of advanced packaging technology across various industries. OSATs are third-party providers that specialize in assembly, testing, and packaging (ATP) services and cater to integrate...

The Microelectronics Technology Opportunity Engine focusses on capturing innovations related to Memristors, Open-Source Processors, Chip Integrated Capacitor, 3D Packaging, Neuromorphic Chip, Hybrid Transistor, Quantum Processor, Cryogenic Memory, Photonic Chip, Ion Based Quantum Chip.The Microelectronics Technology Opportunity Engine captures glob...

3D Integrated Circuit technology enables the development of high performing microchips with small form factor and low-power consumption capability. With the growing demand for miniaturization in industries like consumer electronics and information and communication technology, 3D ICs are actively being considered as the ideal solution. The key requ...

The Microelectronics Technology Opportunity Engine provides profiles of innovations related to Novel Ultrathin LPDDR5X DRAM Packages, Compute Express Link (CXL) Memory Module, Low-loss Glass in Semiconductor Manufacturing and Advanced Semiconductor Packaging material.The Microelectronics Technology Opportunity Engine captures global electronics-rel...

This research analyzes the evolving role of electronics manufacturing service (EMS) providers and original design manufacturers (ODMs) in the dynamic electronics industry. It includes revenue forecasts, drivers and restraints, regional forecast and analysis, vertical market forecast and analysis, and competitive structure. The study also discusses ...