Search results for: 'Application and Opportunity Assessment'

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Advanced Chip Packaging, Edge AI Accelerators, GaN, 6G and Photonics. Some of the innovations profiled include Chips on Panel on Substrate Advanced Chip Packaging for Next-Gen AI Systems, Room-Temperature Printable Ink for Adaptive Electronics, GaN for Ultra-Fast 6G...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to Sub-1 Nm Chip technology, MMIC, SOC, Photonic Chiplet, GaN and Power Electronics among others.The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electron...

The Microelectronics Technology Opportunity Engine covers innovations pertaining to High-Efficiency Power Module for Reliable AI at the Edge Performance, Programmable USB Peripheral Controller to Create USB Devices, Compact AI Supercomputer Platform, Ultra-Wide Band Transceiver, Advanced TPU AI Inference Chip, and Space-based 5G Connection.The Micr...

The Microelectronics Technology Opportunity Engine focusses on capturing innovations related to Memristors, Open-Source Processors, Chip Integrated Capacitor, 3D Packaging, Neuromorphic Chip, Hybrid Transistor, Quantum Processor, Cryogenic Memory, Photonic Chip, Ion Based Quantum Chip.The Microelectronics Technology Opportunity Engine captures glob...

Photonic integrated circuit (PIC) is an optical chip which accommodates multiple photonic functions and is being developed as an alternative for electronic integrated circuits. Their capability to transmit data in optical medium unlike electronic ICs make them effective medium for communication in telecom and datacentre sectors. In case of sensors,...

Transistors are the fundamental electronic components present in any device. They have evolved over a period of 30 years in size and performance. Their capability to act as a switch or amplify current or voltage has enabled them to serve diverse applications ranging from logic gates in the computer processors to sound amplifiers. Research and devel...

The study evaluates photonic and optical computing technologies as critical enablers of next-generation AI infrastructure, addressing growing bandwidth, latency, power consumption, and scalability constraints associated with copper-based interconnects. The analysis covers photonic integrated circuits (PICs), optical I/O chiplets, co-packaged optics...

Real-time location solutions (RTLS) provide accurate information on the location of materials, goods, assets, persons, or vehicles. The system includes tags, readers, and a software solution. This study covers different RTLS technologies that assets send radio signals to, such as wireless fidelity (Wi-Fi), RFID, ultra-wideband (UWB), Bluetooth Low ...

The additive manufacturing sector has seen significant growth in recent years owing to growing demand for customized products and complex geometries in various sectors, including automotive, defense, aerospace, consumer electronics, manufacturing, and energy. AI has a wide range of applications in additive manufacturing at various levels and is a k...